Industry News | 2015-08-23 14:25:07.0
Engineered Material Systems, will showcase its 561-403 Conductive Adhesive at the EU PVSEC show, scheduled to take place September 15-17, 2015 in Hamburg, Germany. EMS 561-403 is a snap cure, low cost conductive adhesive designed for Heterojunction (HIT) and Multi Bus Bar silicon solar modules.
Industry News | 2016-05-09 21:08:21.0
Engineered Material Systems will exhibit its new 561-400 series Low-Cost Snap Cure Conductive Adhesives at the Intersolar/EU PVSEC show, scheduled to take place June 23-25, 2016 in Munich. The 561-400 series is designed for stringing and shingling crystalline silicon and heterojunction solar modules.
Industry News | 2016-07-07 14:54:56.0
Engineered Material Systems will exhibit its new 561-400 series Low-Cost Snap Cure Conductive Adhesives at Intersolar North America, scheduled to take place July 12-14 in San Francisco, CA. The 561-400 series is designed for stringing and shingling crystalline silicon and heterojunction solar modules.
Industry News | 2017-03-14 10:58:12.0
Engineered Material Systems announces the introduction of its new CA-150 Series Snap Cure, Low Cost Conductive Adhesive for stringing and shingling crystalline silicon and Heterojunction solar modules. The new conductive adhesive will be displayed in Hall W3, booths 806/807 at the SNEC PV Power Expo, scheduled to take place April 19-21, 2017 in Shanghai, China.
Industry News | 2017-05-01 14:59:41.0
Engineered Material Systems announces plans to show its CA-150 Series Snap Cure, Low Cost Conductive Adhesive for stringing and shingling crystalline silicon and Heterojunction solar modules at Intersolar Europe. The new conductive adhesive will be displayed in Hall A2, booth 319 at Intersolar Europe, scheduled to take place May 31-June 2, 2017 in Munich, Germany.
Industry News | 2017-08-17 10:22:27.0
Engineered Material Systems announces the introduction of its new CA-150 Series Snap Cure, Low Cost Conductive Adhesive for stringing and shingling crystalline silicon and heterojunction solar modules. The CA-150 Series will be shown for the first time at the EU PVSEC Photovoltaic Exhibition, scheduled to take place September 25-28, 2017 in Amsterdam, The Netherlands.
Industry News | 2018-05-08 19:23:28.0
Engineered Material Systems announces plans to exhibit at the SNEC PV Power Expo, scheduled to take place May 28-30, 2018 in Shanghai, China. The company will showcase its CA-150 Series snap cure, low-cost conductive adhesive for stringing and shingling crystalline silicon and heterojunction solar modules in Hall W3, Booth 806.
Industry News | 2019-05-13 17:45:44.0
Engineered Material Systems announces plans to exhibit at the SNEC PV Power Expo, scheduled to take place June 4-6, 2019 in Shanghai, China. The company will showcase its CA-150 Series snap cure, low cost conductive adhesive for stringing and shingling crystalline silicon and heterojunction solar modules in Hall W4, Booth 353.
Industry News | 2023-06-22 15:16:57.0
YINCAE, a leading manufacturer of electronic materials, has announced the launch of its new product, UF 120HA. The innovative underfill material is specifically designed to provide a fast flow, lower-temperature cure for high-throughput applications and is 100% compatible with all no-clean flux residue. Additionally, it is reworkable, making it an ideal solution for manufacturers looking to reduce costs and improve production efficiency.
Industry News | 2012-06-12 08:47:07.0
Engineered Conductive Materials, LLC,will exhibit the new low temperature curing Conductive Adhesive DB-1541-LTC in North Hall, Booth #5619 at the upcoming Intersolar North America conference and exhibition, scheduled to take place July 10-12, 2012 at the Moscone Center in San Francisco, California.
