Industry News | 2010-02-17 21:16:19.0
SOMERSET, NJ ? Permabond 820 quick-setting, instant adhesive resists temperature ranges up to 200ºC (390ºF). Typical ethyl cyanoacrylates only resist temperatures to 82ºC (180ºF). Permabond 820 is a modified ethyl cyanoacrylate that has a fast fixture time and high-temperature resistance, making it an ideal choice when bonding components in position on dual-sided PCBs prior to wave soldering. Permabond 820 is colorless with a viscosity of 100cPs.
Industry News | 2013-06-10 12:32:44.0
Nordson DAGE, a division of Nordson Corporation (NASDAQ: NDSN) is pleased to announce that its newly developed camera assist automation system will be exhibited in Booth 5971 at the SEMICON West exhibition scheduled to take place on 9-11th July 2013 in San Francisco, Calif.
Industry News | 2014-11-18 18:10:25.0
Nordson DAGE, a division of Nordson Corporation (NASDAQ: NDSN) have adopted the company’s hot pin pull test method for checking the integrity of solder ball attach on packages and PCBs in accordance with the industry standard IPC9708. This particular standard provides guidelines for bond testing to identify potential pad craters.
Industry News | 2018-11-16 19:11:06.0
Nordson DAGE announces that it was awarded a 2018 Global Technology Award in the category of Test Equipment for its 4800 INTEGRA Automatic Wafer Bondtester. The 4800 is the complete solution for automated on wafer bond testing ensuring virtually operator free testing. It is specifically designed for advanced high-density interconnects in both front and back-end applications and utilizes recent advances in operator free technology. The Global Technology Awards recognize and celebrate innovation in electronics manufacturing. Premier products based on the finest examples of creative advancement in technology are chosen by a distinguished panel of industry experts and the Award was presented to the company during a ceremony that took place during SMTA International.
Industry News | 2011-07-18 12:51:32.0
Krayden introduces Dow Corning’s PV-804 Sealant ideal for room-temperature curing.
Industry News | 2001-09-13 08:52:49.0
Epoxy Bonding and Laser Welding Machines Integrate Adept Controls, Precision Stages and Sensing
Industry News | 2011-09-12 11:53:55.0
Nordson DAGE will highlight its latest bond testing and X-ray inspection capabilities in Booth #512 at the upcoming IMAPS 44th International Symposium on Microelectronics.
Industry News | 2011-10-16 00:05:15.0
Nordson DAGE will highlight its latest bond testing and X-ray inspection capabilities in Booth #326 at the upcoming International Symposium for Testing and Failure Analysis (ISTFA).
Industry News | 2022-09-15 06:27:38.0
The Assembly Division of MacDermid Alpha Electronics Solutions, a world leader in the production of electronics soldering and bonding materials, will present the technical paper: "Edge Bonding as Viable Reinforcement For Solder Joints in High Reliability Applications" at the SMTA Penang Chapter Expo & Technical Forum 2022 taking place from September 21 - 22 in Penang, Malaysia.
Industry News | 2010-05-12 13:12:33.0
Delivering a robust alternative to high-temperature solder processes, Henkel has developed Hysol ECCOBOND CA3556HF, a silver-filled electrically conductive adhesive designed to offer fast cure at low temperature. The material is ideal for high-throughput production processes and applications that dictate high peel strength, such as the assembly of photovoltaic (PV) modules, automotive sensors and membrane switches that incorporate temperature-sensitive substrates.
