For flip chip attachment or electrical grounding ACP's for Electrical Interconnection Zymet's ACP’s designed for electrical interconnection are used for flip chip attachment. Applications include chip-on-glass (COG) attachment of driver IC's and
Permabond structural acrylic adhesives are suitable for bonding a wide variety of materials. The rapid, room-temperature cure coupled with high strength and durability make these adhesives ideal for demanding applications where speed and ease of appl
Permabond 2-part epoxy adhesives are suitable for bonding a wide variety of materials. Available with a range of different cure speeds to suit, Permabond epoxies have been developed to offer a high standard of performance for demanding bonding applic
Henkel offers innovative capillary flow underfill encapsulants for flip-chip, CSP and BGA devices. These are highly flowable, high purity, onecomponent encapsulants. They form a uniform and void-free underfill layer to improve reliability performance
Industry Directory | Manufacturer / Other
ISO certified global manufacturer and supplier of light-curable adhesives, coatings, oligomers, dispense systems, light-curing equipment, and technical consulting for the industrial, medical, and electronics industries.
Industry Directory | Manufacturer
IRphotonics is a leader in the design, manufacture, and marketing of Infrared-based materials and systems.
LEN 66A is one part 100% solid, super fast UV curable bonding adhesives, which has been designed for lens attachment, protective cover windows and touch screens. It can also be used for LCD lamination and sealing, polarizer lamination and touch scree
Technical Library | 2015-08-18 14:02:37.0
What is UV Curing? “Ultraviolet (UV) light is an electromagnetic radiation with a wavelength from 400 nm to 100 nm, shorter than that of visible light but longer than X-rays.” (Source: Wikipedia). Ultraviolet or UV curing is used to create a photochemical reaction using high intensity Ultraviolet (UV) energy or “light” to quickly dry inks, adhesives or conformal coatings. Most materials cure with a UV wavelength around 350 ~ 400nm although some materials require UVC energy near 255nm. There are many advantages to using UV curing over other traditional methods of curing. Not only will it increase production speed, it assists in creating a better bond, and improves scratch and solvent resistance. When compared to other methods of curing, UV curing generates a more reliable cured product at a much higher rate of production in a considerably shorter period of time.
WL 66O is one part 100% solid, dual cure UV bonding adhesives, which has been designed for wafer-level lens or optical lens attachment. It can be cured by UV in a few seconds to achieve fast fixing purpose, then further cured by thermal cure to achie
Industry Directory | Manufacturer
Molex is a global leader in interconnect solutions, as well as custom user-interfaces, membrane switches and flex circuits.
