TM230 solderable conductive adhesives are rapid cure, self-filling, self-leveling and self-soldering adhesives which can be used as die attach adhesives for LED, CSP, QFP, among others, to replace conductive adhesives (Ag) or solder materials such as
Industry News | 2014-09-16 11:29:42.0
Engineered Material Systems will introduce its new 561-147 Snap Cure Conductive Adhesive in Hall 1, Booth E19 at EU PVSEC, scheduled to take place Sept. 23-25, 2014 at the RAI Convention & Exhibition Centre in Amsterdam.
Industry News | 2015-08-23 14:25:07.0
Engineered Material Systems, will showcase its 561-403 Conductive Adhesive at the EU PVSEC show, scheduled to take place September 15-17, 2015 in Hamburg, Germany. EMS 561-403 is a snap cure, low cost conductive adhesive designed for Heterojunction (HIT) and Multi Bus Bar silicon solar modules.
Industry News | 2016-05-09 21:08:21.0
Engineered Material Systems will exhibit its new 561-400 series Low-Cost Snap Cure Conductive Adhesives at the Intersolar/EU PVSEC show, scheduled to take place June 23-25, 2016 in Munich. The 561-400 series is designed for stringing and shingling crystalline silicon and heterojunction solar modules.
Industry News | 2016-07-07 14:54:56.0
Engineered Material Systems will exhibit its new 561-400 series Low-Cost Snap Cure Conductive Adhesives at Intersolar North America, scheduled to take place July 12-14 in San Francisco, CA. The 561-400 series is designed for stringing and shingling crystalline silicon and heterojunction solar modules.
Industry News | 2017-03-14 10:58:12.0
Engineered Material Systems announces the introduction of its new CA-150 Series Snap Cure, Low Cost Conductive Adhesive for stringing and shingling crystalline silicon and Heterojunction solar modules. The new conductive adhesive will be displayed in Hall W3, booths 806/807 at the SNEC PV Power Expo, scheduled to take place April 19-21, 2017 in Shanghai, China.
Industry News | 2017-05-01 14:59:41.0
Engineered Material Systems announces plans to show its CA-150 Series Snap Cure, Low Cost Conductive Adhesive for stringing and shingling crystalline silicon and Heterojunction solar modules at Intersolar Europe. The new conductive adhesive will be displayed in Hall A2, booth 319 at Intersolar Europe, scheduled to take place May 31-June 2, 2017 in Munich, Germany.
Industry News | 2017-08-17 10:22:27.0
Engineered Material Systems announces the introduction of its new CA-150 Series Snap Cure, Low Cost Conductive Adhesive for stringing and shingling crystalline silicon and heterojunction solar modules. The CA-150 Series will be shown for the first time at the EU PVSEC Photovoltaic Exhibition, scheduled to take place September 25-28, 2017 in Amsterdam, The Netherlands.
Industry News | 2018-05-08 19:23:28.0
Engineered Material Systems announces plans to exhibit at the SNEC PV Power Expo, scheduled to take place May 28-30, 2018 in Shanghai, China. The company will showcase its CA-150 Series snap cure, low-cost conductive adhesive for stringing and shingling crystalline silicon and heterojunction solar modules in Hall W3, Booth 806.
Industry News | 2019-05-13 17:45:44.0
Engineered Material Systems announces plans to exhibit at the SNEC PV Power Expo, scheduled to take place June 4-6, 2019 in Shanghai, China. The company will showcase its CA-150 Series snap cure, low cost conductive adhesive for stringing and shingling crystalline silicon and heterojunction solar modules in Hall W4, Booth 353.
