Majelac Technologies provides subcontract assembly services to the semiconductor & optoelectronic industries. We specialize in Quick Turn Assembly & Packaging of Ball Grid Array packages and can handle a large variety of other package types.�Majela
Majelac Technologies provides subcontract assembly services to the semiconductor & optoelectronic industries. We specialize in Quick Turn Assembly & Packaging of Ball Grid Array packages and can handle a large variety of other package types.�Majela
Events Calendar | Wed Jun 05 00:00:00 EDT 2019 - Thu Jun 06 00:00:00 EDT 2019 | Neustadt a.d. Donau, Germany
TechDays 2019
The FINEPLACER® lambda is a flexible sub-micron bonder used for precise placement, die attach and advanced packaging. The system offers outstanding flexibility with a modular design and can be easily reconfigured for different applications. The syst
Eclipse Industries DS-107 Aligner Bonder The DS-107 Aligner Bonder is an ultra-high precision, high or low force aligner bonder. Constructed on a granite platform for superior stability and rigidity, the DS-107 is designed for alignment accuracy of
Industry News | 2023-04-03 13:50:11.0
PVA is pleased to announce that it has been awarded a new patent for optical bonding. The patent is an addition to PVA's original bonding patent, "Machine for Optical Bonding, System and Method of Use Thereof."
Those were the Scheugenpflug TechDays 2017! https://www.scheugenpflug.de/en/news/press-releases/article/scheugenpflug-techdays-2017-with-record-attendance-123.html From potting batteries and electric engines to new, high temperature resistant potti
Industry Directory | Manufacturer
ROBOTHERM is an engineering and manufacturing company specialized in the field of semiconductor, smart cards, C.O.B (Chip on Board), C.O.F (Chip on Flex), S.M.T (Surface Mounted Technology) and hybrids applications.
Industry Directory | Manufacturer
Sikama International designs, develops, manufactures and markets reflow solder furnaces/curing systems, featuring our patented conduction+convection heating and cooling technology. Our furnaces are designed for efficient use of power and gas.
Industry News | 2022-06-02 06:56:41.0
PVA is pleased to announce that it received a new patent in Japan for "optical bonding machine having cure in place and visual feedback." The new patent is based upon a machine and method designed specifically for applying a UV cure liquid optically clear adhesive used for bonding cover glass and/or sensors to touchscreens used most commonly in automotive, aerospace, military and medical applications. Key features covered by the patent are related to machine design and methods used.
