Full Site - : snap cure bonding (Page 10 of 55)

Online Two Component Ab Glue Epoxy Automatic Vacuum Dispensing Potting Robot Ab Epoxy System Two Part Dosing Machine

Online Two Component Ab Glue Epoxy Automatic Vacuum Dispensing Potting Robot Ab Epoxy System Two Part Dosing Machine

New Equipment | Dispensing

Whatsapp+86 13425164065 Email: gluepotting@gmail.com Online Two Component AB glue epoxy Automatic vacuum dispensing potting robot ab epoxy system two part dosing machine Two component automatic mixing ratio machine We Daheng Automation specialize

Guangzhou Daheng Automation Equipment Co.,LTD

Membrane Switches

Membrane Switches

New Equipment | Inspection

Molex's membrane switches provide durable, lightweight and low-profile options for integrating user interfaces and electronic components into a variety of applications including medical, industrial and commercial products. Molex standard membrane s

Molex

ECM to Showcase Snap Cure Low-Cost Conductive Adhesives for Interconnecting Solar Cells at Intersolar NA 2012

Industry News | 2012-06-12 08:47:07.0

Engineered Conductive Materials, LLC,will exhibit the new low temperature curing Conductive Adhesive DB-1541-LTC in North Hall, Booth #5619 at the upcoming Intersolar North America conference and exhibition, scheduled to take place July 10-12, 2012 at the Moscone Center in San Francisco, California.

Engineered Materials Systems, Inc.

China Equipment for Accurate Mixing and Dispensing of Two Part Materials

China Equipment for Accurate Mixing and Dispensing of Two Part Materials

New Equipment | Dispensing

Two component (also called meter mix) dispensing systems are used for mixing and dispensing two part materials, typically adhesives. The two parts of the adhesive come together in the system, typically through a static mixer, and activate to start th

Guangzhou Daheng Automation Equipment Co.,LTD

YINCAE Launches Snap Cure, Highly filled ,100% No-Clean Flux Residue Compatible Underfill: UF 120HA

Industry News | 2023-06-22 15:16:57.0

YINCAE, a leading manufacturer of electronic materials, has announced the launch of its new product, UF 120HA. The innovative underfill material is specifically designed to provide a fast flow, lower-temperature cure for high-throughput applications and is 100% compatible with all no-clean flux residue. Additionally, it is reworkable, making it an ideal solution for manufacturers looking to reduce costs and improve production efficiency.

YINCAE Advanced Materials, LLC.

Circuit Technology Center Releases Updated Bonding System

Industry News | 2021-11-12 04:07:03.0

Circuit Technology Center announces it has released an updated version of its popular Bonding System.

Circuit Technology Center, Inc.

sandwich panel Two-component polyurethane (PU) glue laminating machine

sandwich panel Two-component polyurethane (PU) glue laminating machine

New Equipment | Dispensing

Two-component polyurethane (PU) glue laminating machine The two-component polyurethane (PU) glue spraying machine is mainly used to evenly and quickly spray the two-component polyurethane A and B glue mixture on the bonding surface of larger-format b

Guangzhou Daheng Automation Equipment Co.,LTD

Engineered Material Systems Introduces New UV Cured Adhesive for Bonding Lens Holders in Camera Modules

Industry News | 2017-03-22 13:56:25.0

Engineered Material Systems is pleased to debut its 631-39 UV plus thermal cured adhesive for bonding lens holders in camera module applications.

Engineered Materials Systems, Inc.

Engineered Material Systems Introduces New UV-Cured Adhesive for Bonding Lens Holders in Camera Modules

Industry News | 2017-10-18 20:37:52.0

Engineered Material Systems is pleased to debut its 631-68 UV plus thermal cured adhesive for bonding lens holders in camera module applications.

Engineered Materials Systems, Inc.

Effect of Silicone Contamination on Assembly Processes

Technical Library | 2013-02-07 17:01:46.0

Silicone contamination is known to have a negative impact on assembly processes such as soldering, adhesive bonding, coating, and wire bonding. In particular, silicone is known to cause de-wetting of materials from surfaces and can result in adhesive failures. There are many sources for silicone contamination with common sources being mold releases or lubricants on manufacturing tools, offgassing during cure of silicone paste adhesives, and residue from pressure sensitive tape. This effort addresses silicone contamination by quantifying adhesive effects under known silicone contaminations. The first step in this effort identified an FT-IR spectroscopic detection limit for surface silicone utilizing the area under the 1263 cm-1 (Si-CH3) absorbance peak as a function of concentration (µg/cm2). The next step was to pre-contaminate surfaces with known concentrations of silicone oil and assess the effects on surface wetting and adhesion. This information will be used to establish guidelines for silicone contamination in different manufacturing areas within Harris Corporation... First published in the 2012 IPC APEX EXPO technical conference proceedings.

Harris Corporation


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