The mission of Unipress is to use high pressure methods for advanced fundamental research and technology development. The main fields: Solid state physics, Optoelectronics, Sintering of nanocrystalline materials...
Advanced Solder Paste Printer with 2D and 3D SPI On-Board Standard Features Include: 3D Solder Paste Inspection 2D Solder Paste Inspection 3 Stage Automatic Conveyor Under Stencil Cleaning Full Process Control Programmable
MODEL NAME:HP-350M ;HP-520S ; HP-680S ; HP-850S ; HP-1000S Benefit High speed printing realization (2.0Cpk @ ±25㎛) Fine Pitch(0.2mm) , CSP , 0402 Control of printing speed and pressure over 5 sections Various P
Electronics Forum | Sun Jan 28 21:50:22 EST 2001 | Dreamsniper
Hi Adrian, If you do a "squeegee snap off" during solder paste printing...the result would be a very thick solder paste deposition. I think the correct term is stencil snap off or people say it "snap off distance". =)
Electronics Forum | Fri Jan 12 16:29:22 EST 2001 | blnorman
Snap off is the distance from the top of the board to the bottom of the stencil.
Used SMT Equipment | Screen Printers
MPM Momentum+ Printer Substrate treatment Maximum plate size(XxY) 609.6 mm x 508 mm(24”x 20”) Segmented mode-Momentum Elite 457 mm x 508 mm(18"x20") Minimum Plate Size (XxY)
Used SMT Equipment | Screen Printers
Momentum was designed and built to be a no-nonsense production machine. Cost-efficient and featuring a modest footprint, it grows with the user; innovative patented features can be added on or retrofitted as needed as the user’s throughput dema
Industry News | 2016-12-09 23:33:42.0
GPD Global offers advanced dispense pump technologies to upgrade your existing platform and take advantage of existing capital equipment. Retrofit your system with innovative dispensing technology for excellent dispense control and repeatability.
Industry News | 2012-03-07 21:08:08.0
The electronic interconnect industry came together at IPC APEX EXPO® last week in San Diego, with the show reporting a 26 percent increase in attendance over 2011 with 4,915 conference and exhibit hall attendees. IPC reported that 407 exhibitors participated in the event, resulting in 8,963 total visitors.
Parts & Supplies | Pick and Place/Feeders
torque wrench, snapped off, , 0,2-2Nm
Parts & Supplies | SPI / Solder Paste Inspection
Quick programming, friendly programming interface Multiple measurement methods True one-button measurement Eight-way motion button, one-click focus Adjustable scanning pitch Solder paste 3D simulation function Powerful SPC function MARK
Technical Library | 2016-03-17 19:09:46.0
The rapid growth of electronic devices across the globe is driving manufacturers to enhance high-speed mass production techniques in the PCB assembly arena. As manufacturers drive to reduce costs while maximizing production by expanding facilities, updating automation equipment, or implementing lean six sigma techniques, the potential to build scrap product or rework printed circuit boards increases dramatically.Manufacturers have two general paths to reduce the costs of high-speed printed circuit board assembly production. The first path is to reduce cost by focusing on high quality printing and mounting. The other, increasingly popular option is to utilize low-cost materials. In either case, the baseline must provide a consistent high-speed solder paste printing method, which considers the fill, snap-off, and cleaning processes.Building on our expertise and testing, this paper will highlight the two trains of thought with specific focus on how low-cost materials affect print performance. It will also explore technologies, which can help provide stable, high-speed screen printing.
http://www.gpd-global.com No drip no drool across a wide range of fluid viscosities (low-to-mid and low-to-high). No manual adjustment to compensate for pump variability. Truly Volumetric PCD Pumps for total control of dispensing fluids. Ability to
ZEVAv selective soldering machine delivers the best value in the high-speed selective soldering market. The ZEVAv platform leverages proven, market-leading fluxing, preheating and soldering technology to meet the growing challenges of high yields, co
GPD Global | https://www.gpd-global.com/co_website/pdf/doc/FLOware-Software-Guide-Addendum-Deferred-Reverse.pdf
. Snap Off Z Distance the needle moves from the last dispense height after dispense is completed. Used to separate the needle from the material
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2018/06/HellerSetupWizard-10658.pdf
: to turn main N2 solenoid On/Off from overview screen. Auto Purge / Standby: option is used for nitrogen purge/standby (high, normal and low flow
