Industry Directory | Consultant / Service Provider
We work on the physical design, reliability and failure analysis of electronic components, solder joints and PCB assemblies. We provide expertise in the assessment of both standard SnPb and Pb-free solder joint reliability.
Industry Directory | Manufacturer
New England CM is a contract manufacturer for high speed assembly of SMT and mixed technology PCBs specializing in prototype and medium production runs.
New Equipment | Education/Training
This guide includes everything needed for repair and rework of electronic assemblies and printed circuit boards! IPC-7711B/7721B Rework, Modification and Repair of Electronic Assemblies has received a complete procedure by procedure update to assure
New Equipment | Rework & Repair Equipment
SemiPack offers BGA Reballing Services with speed, reliability and affordability that are unrivalled in the industry. The Restriction of Hazardous Substances (RoHS) directive restricts the use of lead in nearly all electronic components used today.
Electronics Forum | Fri Apr 13 21:02:19 EDT 2007 | Sam
Anyone experience using SnPb wire to gold plated ICs? I have tried to solder the SnPb wire to the gold plated ICs lead, but the surface finishing is dull. Can anyone explain that to me? Why it is not shinny surface? Any recommendation?
Electronics Forum | Thu May 06 10:52:08 EDT 2004 | John S
Many component manufacturers are moving to Pb free terminations. I've been doing a literature study of Pb free processing and have found several articles that indicate Pb-free paste with Sn/Pb terminations leads to early fatigue failures. Does anyo
Used SMT Equipment | Soldering - Wave
Speedline Electrovert Wave Soldering Machine Model: Vectra 450F Year: 2001 Power: 480V / 3-Phase 3 Bottom-Side Preheat (2 Convection + 1 IR) 1 Top-Side Preheat (IR) Leaded Pot (63/37 SnPb)
Used SMT Equipment | Soldering Equipment/Fluxes
SALDATRICE A ONDA Sn/Pb SOLTEC 6622CC, vintage 2000, 3 x 400V con 400 kg di stagno nel pozzetto in ottime condizioni.
Industry News | 2005-09-19 16:07:56.0
No higher temperature and No process changes needed
Industry News | 2018-10-18 09:34:29.0
Application of lead-free solder
Technical Library | 2023-01-17 17:27:13.0
Reflow profile has significant impact on solder joint performance because it influences wetting and microstructure of the solder joint. The degree of wetting, the microstructure (in particular the intermetallic layer), and the inherent strength of the solder all factor into the reliability of the solder joint. This paper presents experimental results on the effect of reflow profile on both 63%Sn 37%Pb (SnPb) and 96.5%Sn 3.0%Ag 0.5%Cu (SAC 305) solder joint shear force. Specifically, the effect of the reflow peak temperature and time above solder liquidus temperature are studied. Nine reflow profiles for SAC 305 and nine reflow profiles for SnPb have been developed with three levels of peak temperature (230 o C, 240 o C, and 250 o C for SAC 305; and 195 o C, 205 o C, and 215 o C for SnPb) and three levels of time above solder liquidus temperature (30 sec., 60 sec., and 90 sec.). The shear force data of four different sizes of chip resistors (1206, 0805, 0603, and 0402) are compared across the different profiles. The shear force of the resistors is measured at time 0 (right after assembly). The fracture surfaces have been studied using a scanning electron microscopy (SEM) with energy dispersive spectroscopy (EDS)
Technical Library | 2012-10-04 18:52:43.0
First published in the 2012 IPC APEX EXPO technical conference proceedings... Due to the obsolescence of SnPb BGA components, electronics manufacturers that use SnPb solder paste either have to use lead-free BGAs and adjust the reflow process or re-ball t
ACI Technologies Inc. (ACI) is a scientific research corporation dedicated to the advancement of electronics manufacturing processes and materials for The Department of Defense and industry. This video provides an overview of our commercial service
Career Center | Rochester, New York USA | Engineering
I have done my undergraduate studies in Mechanical Engineering. I am pursuing my Master's Program in Electronics Packaging. I am currently working as a Research Assistant for RIT-CEMA (Center for Electronics Manufacturing and Assembly). My research
GPD Global | https://www.gpd-global.com/co_website/fluid-dispense-solderpaste-lead.php
. Our line of automated dispense systems and pumps are capable of dispensing any pattern including dots, lines, complex shapes, micro volumes for components such as 01005, and pin in paste. Density of SnPb (0.303) / SAC305 (0.268) = 1.13 EXAMPLE
Surface Mount Technology Association (SMTA) | https://www.smta.org/knowledge/proceedings_abstract.cfm?PROC_ID=4717
(bottom solder joints (SnPb paste/SAC305 solder balls) exhibited excellent TMF performance (η = 2600 ±200 cycles; Β = 7.6 ±3.5) as did the middle (η = 2500 ±300 cycles; Β = 6.6 ±3.4) and top joints (η = 2600 ±200 cycles; Β = 8.7 ±4.0). The 100% SAC305 test vehicle showed comparable
