Electronics Forum | Mon Feb 19 14:28:35 EST 2007 | John
To: Wave Master Larry, You are correct in one respect. There is always dross on the wave, but it is a result of oxidation of the tin and lead. It IN NO WAY POSITIVELY EFFECTS the solder process, in fact, dross trapped in the solder joint is a detri
Electronics Forum | Thu Apr 15 08:21:47 EDT 1999 | Terry Keen
| We process both tin/lead plated boards and gold plated boards in our surface mount group. I have used Sn62/Pb36/Ag2 solder paste on all gold plated boards to help prevent gold scavaging. To reduce the amount of different solder pastes we have to
Electronics Forum | Thu Apr 15 09:45:34 EDT 1999 | Terry Keen
| | We process both tin/lead plated boards and gold plated boards in our surface mount group. I have used Sn62/Pb36/Ag2 solder paste on all gold plated boards to help prevent gold scavaging. To reduce the amount of different solder pastes we have t
Electronics Forum | Thu Jan 27 14:49:53 EST 2000 | Glenn Robertson
Tuan - One of the reasons I suggested pre-tinning (aside from the negative effects of Gold on appearance and reliability) is the known slower wetting of Sn/Ag and Sn/Cu alloys as compared to Sn/Pb. If you don't have to be Lead-free, the high Lead
Electronics Forum | Mon Apr 19 02:45:31 EDT 1999 | Brian Sloth Bentzen
| | We process both tin/lead plated boards and gold plated boards in our surface mount group. I have used Sn62/Pb36/Ag2 solder paste on all gold plated boards to help prevent gold scavaging. To reduce the amount of different solder pastes we have t
Electronics Forum | Wed Jun 30 12:14:40 EDT 1999 | John Thorup
| | We are wave soldering some fabs with a lot of unmasked trace area along the edges. The trace area is solid copper covered with tin / lead, no masking, no components along the edges, same on solder side and component side (goofy board design). I
Electronics Forum | Fri Jul 02 10:06:17 EDT 1999 | John Thorup
| | | | We are wave soldering some fabs with a lot of unmasked trace area along the edges. The trace area is solid copper covered with tin / lead, no masking, no components along the edges, same on solder side and component side (goofy board design)
Electronics Forum | Fri Jul 02 05:28:13 EDT 1999 | Vinesh gandhi
| | | We are wave soldering some fabs with a lot of unmasked trace area along the edges. The trace area is solid copper covered with tin / lead, no masking, no components along the edges, same on solder side and component side (goofy board design).
Electronics Forum | Fri Jul 02 09:54:02 EDT 1999 | John Thorup
| | | | We are wave soldering some fabs with a lot of unmasked trace area along the edges. The trace area is solid copper covered with tin / lead, no masking, no components along the edges, same on solder side and component side (goofy board design)
Electronics Forum | Mon Feb 04 14:42:08 EST 2008 | ratsalad
Are you talking about Durastone? That's what we use for our wave pallets. Both our wave vendor and solder bar vendor told us that we had nothing to worry about as far as Pb-contamination of the pallets. We have used the same pallets across our Sn
