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Juki  Cleanroom wiper from Wisdom

Juki Cleanroom wiper from Wisdom

Parts & Supplies | SMT Equipment

SMT  Cleanroom wiper ,the details are as below: SMT stencil clean: Roll improve the working efficiency, control the waste material actively, save cost. We can made products as per the customer’s detail specification. Cleanroom Cloth: Made of 100%

Wisdom Shining Electronic Technology (China) Limited

Juki Supplying Cleanroom wiper

Juki Supplying Cleanroom wiper

Parts & Supplies | SMT Equipment

SMT  Cleanroom wiper ,the details are as below: SMT stencil clean: Roll improve the working efficiency, control the waste material actively, save cost. We can made products as per the customer’s detail specification. Cleanroom Cloth: Made of 100%

Wisdom Shining Electronic Technology (China) Limited

Juki supply Cleanroom wiper

Juki supply Cleanroom wiper

Parts & Supplies | SMT Equipment

SMT  Cleanroom wiper ,the details are as below: SMT stencil clean: Roll improve the working efficiency, control the waste material actively, save cost. We can made products as per the customer’s detail specification. Cleanroom Cloth: Made of 100%

Wisdom Shining Electronic Technology (China) Limited

Combination of Spray and Soak Improves Cleaning under Bottom Terminations

Technical Library | 2014-10-23 18:10:10.0

The functional reliability of electronic circuits determines the overall reliability of the product in which the final products are used. Market forces including more functionality in smaller components, no-clean lead-free solder technologies, competitive forces and automated assembly create process challenges. Cleanliness under the bottom terminations must be maintained in harsh environments. Residues under components can attract moisture and lead to leakage currents and the potential for electrochemical migration (...) The purpose of this research study is to evaluate innovative spray and soak methods for removing low residue flux residues and thoroughly rinsing under Bottom Termination and Leadless Components

KYZEN Corporation

Dynamic Manufacturing LLC

Industry Directory | Manufacturer

Dynamic Manufacturing specializes in Electronic Manufacturing Services: Surface Mount Printed Circuit Boards (PCB's), Through-hole PCB's, Prototyping, Testing, Inspection, Conformal Coating, Enclosures. Contract Design: Printed Circuit Boards, Temper

Profile Planner - Reflow Profiling Software

Profile Planner - Reflow Profiling Software

New Equipment | Software

Match Solder Paste Specifications and Oven Configurations to Provide Robust Process Profiles... The Profile Planner is an Microsoft® Excel Workbook Application that allows you to match Solder Paste specifications and Oven specifications. You can the

Electronic Controls Design Inc. (ECD)

Bransonics

Bransonics

New Equipment |  

Ultrasonic cleaning is faster, more consistent, and safer than any other method. Hand scrubbing, soaking, or steam don't even come close. The Bransonic table top cleaners now include the same high power, rugged transducers found on industrial systems

SMTinspection.com

Optimizing for Test Cell Throughput: Multitest’s MT2168 Fully Leverages Advanced Tester Capabilities

Industry News | 2011-06-09 14:01:00.0

Multitest announces that its MT2168 is designed for best tester utilization. Short index time (DUT exchange time), fast loading and sorting, and a high soak capacity support the handler to keep pace with the new tester generation.

Multitest Elektronische Systeme GmbH

Multitest's MT2168 Optimizes for Cost and Throughput — Even for Less than 16 Sites

Industry News | 2011-09-28 19:30:18.0

Multitest announces that the MT2168 fully leverages today’s tester capabilities in terms of shorter test times and higher parallelism, e.g. 16 sites.

Multitest Elektronische Systeme GmbH

Instrumentation for Studying Real-time Popcorn Effect in Surface Mount Packages during Solder Reflow

Technical Library | 2014-06-12 16:40:19.0

Occurrence of popcorn in IC packages while assembling them onto the PCB is a well known moisture sensitive reliability issues, especially for surface mount packages. Commonly reflow soldering simulation process is conducted to assess the impact of assembling IC package onto PCB. A strain gauge-based instrumentation is developed to investigate the popcorn effect in surface mount packages during reflow soldering process. The instrument is capable of providing real-time quantitative information of the occurrence popcorn phenomenon in IC packages. It is found that the popcorn occur temperatures between 218 to 241°C depending on moisture soak condition, but not at the peak temperature of the reflow process. The presence of popcorn and delamination are further confirmed by scanning acoustic tomography as a failure analysis.

WASET - World Academy of Science, Engineering and Technology


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PCB Handling Machine with CE

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High Throughput Reflow Oven
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500+ original new CF081CR CN081CR FEEDER in stock