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Time & Money Saved with New 'HD' Stencil Material

Industry News | 2002-07-23 03:19:20.0

Datum Alloys (suppliers of specialist alloys) Has Found The Solution To High Density & Ball Grid Array Stencils

Datum Alloys Ltd

Seika Offers Malcom SPS-2000 Solder Paste Mixer Demo Unit for Evaluations

Industry News | 2018-04-30 16:02:25.0

Seika Machinery today announced that it has a demo unit available for the new Malcom SPS-2000 Solder Paste Mixer. This new version adds a number of new functions to make sure your paste is at its optimum condition for use.

Seika Machinery, Inc.

Bliss Industries Announces New Product Lineup for IPC/APEX 2010

Industry News | 2010-04-11 00:03:19.0

MILPITAS, Calif.- Bliss Industries Inc., provider of material handling carts and racks for PCB assembly, announces its new product lineup to be introduced in booth 471 at the upcoming IPC/APEX conference and exhibition.

Bliss Industries, Inc.

Krayden Adds Molykote 111 Lubricant and Sealant for Valves to Its Repertoire

Industry News | 2010-06-16 10:42:58.0

DENVER, CO — Krayden, Inc., a leading distributor of engineered materials, announces that it now provides the Molykote 111 valve lubricant and sealant from Dow Corning. The compound is a silicone oil that offers water resistance, low vapor pressure, low volatility and a wide service temperature range of -40°C/-40°F to 200°C/392°F.

Krayden Inc.

Seika Machinery Introduces Updates to Popular Malcom and Unitech Process Control Systems

Industry News | 2018-08-09 12:24:23.0

Seika Machinery is pleased to announce that it carries six new process control devices from MALCOM and UNITECH. These include: SPS series paste mixers, viscometers, wetting balance testers, profilers / camera systems, reflow simulators and PCB board cleaners.

Seika Machinery, Inc.

PCB Protection with Macromelt

PCB Protection with Macromelt

Videos

Low Pressure Molding with Macromelt. Low pressure molding is an innovative manufacturing process between injection molding and potting. A cost effective and environmentally friendly alternative to epoxy potting for fragile electronic components. When

Henkel Electronic Materials

AI Technology, Inc (AIT) Develops Temporary Bonding Wax for Precision Wafer and Substrate Back-grinding and Thinning Applications

Industry News | 2014-09-05 13:53:06.0

AI Technology, Inc (AIT) Develops Temporary Bonding Wax for Precision Wafer and Substrate Back-grinding and Thinning Applications. AI Technology, Inc. (AIT) has recently developed a series of temporary wax-like media that has been proven to be useful in many of these thinning applications.

AI Technology, Inc. (AIT)

Water Soluble, Tin-Lead Solder Paste from Henkel Enables High-Yield Results for Demanding Applications

Industry News | 2017-02-23 13:23:33.0

Henkel’s market leadership in solder materials development continues with the commercial launch of LOCTITE HF 2W, a tin-lead, water-washable solder paste designed for high-throughput, high-yield production. Halide- and halogen-free and REACH compliant, LOCTITE HF 2W addresses environmental responsibility while delivering outstanding performance for Pb-based soldering.

Henkel Electronic Materials

Steven Abramovich Appointed Head of Sales, Americas for Henkel’s Electronics Business

Industry News | 2017-03-01 13:13:55.0

Henkel Adhesive Technologies today announced that Steven Abramovich has been named Head of Sales, Americas for its electronics business. Previously Vice President of Channel Management for the company, Abramovich lends 30 years of results-driven sales and marketing experience to his new role.

Henkel Electronic Materials

TECHNOMELT AS 8998 Masking Material Producing Measurable Gains in Efficiency, Cost Control; Recognized with Industry Award

Industry News | 2017-03-06 12:24:15.0

Last month at the IPC APEX Expo event in San Diego, California, Henkel’s TECNOMELT AS 8998 hot melt masking material was presented with a Circuits Assembly NPI award in recognition of its ability to meet several criteria, including: creativity and innovation, compatibility with existing technology, cost-effectiveness, design, expected reliability, flexibility, speed/throughput improvements, performance, user-friendliness, and expected maintainability and reparability. The award capped off what has been a successful first year for TECHNOMELT AS 8998, which was commercialized in early 2016 and has already lowered cost and improved operational efficiency at several global electronics manufacturers.

Henkel Electronic Materials


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