Electronics Forum | Fri Apr 18 19:27:29 EDT 2003 | yngwie
Under web search you type solder paste softener. It is meant to replace manual stiring process of solder paste prior use. I heard that the spinner/softener is no use as it will seperate the flux and metal content during the spinning process. But, I h
Electronics Forum | Wed Apr 16 03:16:11 EDT 2003 | emeto
Hi,what exactly means automated solder paste softener? Explain me please and I promise to try answer you correctly.
Electronics Forum | Tue Apr 27 00:18:08 EDT 2004 | Garian
Since you have used malcom softener, did you encounter and sudden rise of void level in the solder joints as compared to manual stirring?
Electronics Forum | Mon May 17 14:14:36 EDT 2004 | cg
Or is solder quality better with automated mixing?
Electronics Forum | Mon May 17 15:14:12 EDT 2004 | solderpro
Agree with Joe 100%, we recently brought one in from Malcolm for trial, this company had not practiced viscosity reading or anything in the process, the trail run was a great improvement in print, consistancy, deposition and formation of the solder b
Electronics Forum | Sat Apr 19 10:45:43 EDT 2003 | Joe
Yngwie, In a previous life, I used a mixer made by Malcolm and was very happy with it. We used Alpha 609 WS paste and experienced no separation problems. The Malcolm equipment agitated the material in a non-concentric motion which tends to "fold
Electronics Forum | Fri Mar 28 10:21:16 EDT 2014 | davef
With heat, most underfills soften just before the solder melts. So, keep poking the underfill until you see it soften. Then, wait just the correct amount of time until the solder melts and quickly snap or torque the part from the board. BR davef
Electronics Forum | Tue Jun 11 14:16:03 EDT 2013 | bandjwet
We are involved in a project for microBGA SAC rework. The pitch is 0.4mm and the devices are underfilled (softening 150C). The underfill comes off fairly easily but the pressure underneath the package as the underfill softens pushes up on the undersi
Electronics Forum | Tue Jun 11 14:21:35 EDT 2013 | bandjwet
We are involved in a project for microBGA SAC rework. The pitch is 0.4mm and the devices are underfilled (softening 150C). The underfill comes off fairly easily but the pressure underneath the package as the underfill softens pushes up on the undersi
Electronics Forum | Fri Sep 01 03:06:20 EDT 2000 | Adelina Baggayan
Hi!, Can anyone help me with problems with Solder voids after reflow curing on D2PAK heatsinks? I would like to remove the gas from the solder paste; can centrifuge help?How many minutes should a solder paste in a tube be processed in a softener? Ho
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