Electronics Forum | Fri Jun 19 15:17:54 EDT 1998 | Chris Jackson
We are in the process of validating Silicon 1C55 (thermal cure) conformal coating over Alpha LR725 solder paste. I am looking for anyone who may be using this process, or has been exposed to someone who is doing this process. Our concern is with the
Electronics Forum | Mon Jan 13 16:24:15 EST 2003 | russ
Youch! I know this is going to sound stupid but.... I have done it in the past in limited quantities. We placed capton (polyimide) tape at each of the four corners for a similar situation. It did work but the operator has to be careful in placing
Electronics Forum | Thu Jul 22 07:52:37 EDT 2004 | Chris L.
Hi Grant, The purpose for allowing the solder paste to reach room temp before production is to reduce the amount of water absobtion from the air. (e.g. a cold glass of water "sweats" on a humid day)The purpose for mixing is to make the viscosity more
Electronics Forum | Thu Jul 22 21:26:29 EDT 2004 | Grant
Hi, It's removed from the fridge, and the tube is loaded into the stencil printer, however it's winter here right now, so it's still quite cold. It's Australia, so when I say cold, that's relative, however the room can be about 10 dec C in the morni
Electronics Forum | Mon Aug 22 09:01:09 EDT 2005 | iwan
Well guys, I just buy a brand new solder paste softener Malcom type SPS2, I've tried with this with this viscosity result. I Use Almit Solder Paste Lead Free LFM-52X 1 min : 264 pas. 2 min : 272 pas. 3 min : 277 pas. I use standard for Viscosity 20
Electronics Forum | Thu Oct 27 05:51:17 EDT 2005 | pavel_murtishev
Good day, Search the net with "Solder paste softener", or check the links below: *Malcom http://www.malcomtech.com/products_sps.html *Japan UNIX http://www.japanunix.co.jp/ju_en/products/UM-103.html *Genitec http://www.genitec.com.tw/gam-60-e.htm
Electronics Forum | Wed Dec 24 11:49:46 EST 2008 | bandjwet
Put on your thinking caps for this one......We are trying to remove a BGA (10 x 10mm, plastic, 0.8mm pitch) which is approx 3 mm next to another BGA (5 x 5mm, plastic, 0.8mm pitch). The challenge is this second device is underfilled with a softening
Electronics Forum | Wed Dec 24 18:31:04 EST 2008 | hegemon
If they share a common ground plane you are in for some difficulty in trying to prevent the second part from heating too much. What happens to the underfill material when it is softened by being heated beyond the 160C? Does it harden up again, or b
Electronics Forum | Thu Feb 12 12:30:16 EST 2015 | stevezeva
I remembered something from the TechNet a long time ago about heating the board with a heat gun to see if the white spots disappear. I searched the archives and found this from Bill Kenyon: Quick identification of solder mask white spots- if it is t
Electronics Forum | Wed Mar 04 08:32:45 EST 2020 | stephendo
We bought a conformal coating removal machine AKA a sand blaster at an auction. It is a CCR2000 especially made to be ESD safe. Does anyone have any experience with sandblasting conformal coating? We mostly use humiseal 1A33 and UV40. When we use the
