YSPEPCB/FPCPunchingMachineFeature: 1?PCBA Punch Machine is punch mold machine. 2?Equipment,compactstructure,solidbody,cylinderbore125,160,200AirTAC. 3?Equipment running smoothly,low vibration,lownoise. 4?English touch screen display,clear panel,al
YUSH Electronic Technology Co.,Ltd 1?PCBA Punch Machine is punch mold machine. 2?Equipment,compact structure,solid body,cylinder bore 125,160,200Air TAC. 3?Equipment running smoothly,low vibration,low noise. 4?English touch screen display,clear p
Industry News | 2021-06-02 22:48:27.0
Every year in the United States, about 2,000 people lose their lives in residential fires. In a fire, smoke and deadly gases tend to spread farther and faster than heat. That's one reason why most fire victims die from inhalation of smoke and toxic gases, not from burns. A majority of fatal fires happen when families are asleep because occupants are unaware of the fire until there is not adequate time to escape. A smoke alarm stands guard around the clock, and when it first senses smoke, it sounds like a shrill alarm. This often allows a family the precious, but the limited time needed to escape. About two-thirds of home fire deaths occur in homes with no smoke alarms or no working smoke alarms. Properly installed and maintained smoke alarms are considered to be one of the best and least expensive means of providing an early warning of a potentially deadly fire and could reduce by almost half the risk of dying from a fire in your home.
Industry Directory | Consultant / Service Provider
Founded in 1987, NovaStor Corporation is a leading developer and marketer of data management, data protection, and disaster recovery software for desktops and corporate networks.
Technical Library | 2013-02-08 22:56:47.0
Solder voiding is present in the majority solder joints and is generally accepted when the voids are small and the total void content is minimal. X-ray methods are the predominate method for solder void analysis but this method can be quite subjective for non grid array components due to the two dimensional aspects of X-ray images and software limitations. A novel method of making a copper "sandwich" to simulate under lead and under component environs during reflow has been developed and is discussed in detail. This method has enabled quantitative solder paste void analysis for lead free and specialty paste development and process refinement. Profile and paste storage effects on voiding are discussed. Additionally an optimal design and material selection from a solder void standpoint for a heat spreader on a BCC (Bumpered Chip Carrier) has been developed and is discussed.
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Are you tired of limited imagination holding you back from realizing your electronic product visions? Let's unleash the full potential of your ideas together! At UTI, we believe that every great product starts with a daring dream
Consistently improve quality and reduce cost with automated profiling, SPC, and traceability for wave solder machines.
PRISM is the new Reliability Analysis Center (RAC) software tool that ties together several tools into a comprehensive system reliability prediction methodology. The PRISM concept accounts for the myriad of factors that can influence system reliabil
PRISM is the new Reliability Analysis Center (RAC) software tool that ties together several tools into a comprehensive system reliability prediction methodology. The PRISM concept accounts for the myriad of factors that can influence system reliabil
Industry Directory | Consultant / Service Provider / Manufacturer
We provide extensive embedded hardware and software for ARM based microcontroller, such as development board, emulator,etc.
