Used SMT Equipment | Pick and Place/Feeders
Automatic pick and place machine 210 is the high cost-effective equipment in the market, it can pick and place variety of components by its vacuum nozzle. The machine can mount 0402、 SOIC、PLCC、QFP IC and many SMD chip components; optional vision pos
Used SMT Equipment | Chipshooters / Chip Mounters
Product Details: Machine type: PA 1100/04 Technology Max, Body size: 0402 to SOIC20 Max Board Dim (Lenght x width): 460/50 mm x 460/50 mm tact time: .072 seconds Components/Hr: 50,000 Operating System: IBM OS/2 Version 3.00 Software Version: 5.21
Chips, SOIC's, SSOP's, SOJ's, PLCC's, BGA's, socket's, QFP's, Odd form devices, connectors, switches and any custom components.
High-density SRAM, Flash, EEPROM, and DRAM in BGA, QFP, SIMM, DIMM, PLCC, flatpack, ZIP, SOIC, DIP, and other packages. PC Cards. High-reliability packaging for extreme environments and military applications.
Packaging of discontinued semiconductor devices (when die are available)in all packaging styles such as DIP, SIP, SOIC, SMT, etc.
100 different practice boards covering the entire range of SMD components: BGA, QFP, TQFP, TSOP, SOIC, discrete and chips. With fiducials. HASL and Entek available.
Accept a surface mount package and plug into a DIP socket on an EPROM programmer. Available for DIP, PLCC, QFP, SOIC, SSOP, TSOP, TSSOP and QSOP
Accept a device and either plug into an EPROM emulator or production socket or solder down to a land pattern. Available for DIP, PLCC, SOIC and QFP packages.
Plug into a DIP socket and provide a land pattern for soldering down an SOIC or SSOP device. Use to replace unavailable packages.
Industry Directory | Manufacturer's Representative
MiniATE Systems represents world class manufacturers of high quality IC Sockets & Connectors for Test & Burn-in, Development and Electronic Production.
