New Equipment | Education/Training
BEST SMT training kits feature REAL circuit boards that represent actual soldering conditions. These training kits feature 0.062in thick multilayer boards which are more representative of the thermal conditions of "real" circuit boards. This SMT tra
New Equipment | Education/Training
BEST training kits feature REAL circuit boards that represent actual soldering conditions. These training kits feature ".062 thick multilayer boards which are more representative of the thermal conditions of "real" circuit boards. This board feature
Electronics Forum | Thu May 01 12:28:56 EDT 2008 | petergog
what is the main concern about this reqirement? Why IPC-A-610c is revsised to this? IPC-A-610c said it is a defect.Solder touches the body of a plastic bodied component, eg SOICs and SOTs. But D version think it is acceptable. WHY? I thought "plasti
Electronics Forum | Wed May 03 15:45:44 EDT 2006 | Tim
Brett, I've found out that it is not a defect with respect to Rev. D. You are correct about the thermal expansion but due to the size of the plastic SOIC's and SOT's they have eliminated it as a defect. Thanks, Tim
Used SMT Equipment | AOI / Automated Optical Inspection
Hello and thank you for your interest in our MVP Machine Vision Products AOI Machines For Sale. We have a total of (4) MVP Automated Optical Inspection Machines and (2) Inspection Repair Stations.. They were taken off line due to company closer. All
Used SMT Equipment | Chipshooters / Chip Mounters
Serial #: 4796L-0-10032690 Placements: 05,658,463 / Condition: Good Working, No Missing Parts PCB Size: MAX 457x508mm, MIN 50x50mm, MAX WIDTH is 5 mm, MIN WIDTH is 0.4 mm PCB Flow: Left - Right, Front Left Origin Fixed Rail: Front Fixed
Industry News | 2018-10-18 08:53:06.0
Mixed process of SMT reflow oven
Industry News | 2018-12-08 03:29:29.0
SMT Dictionary – Surface Mount Technology Acronym and Abbreviation
Parts & Supplies | Pick and Place/Feeders
SMT basic process components include: silk screen (or dispensing), placement (curing), reflow soldering, cleaning, testing, repair 1, silk screen: its role is to paste or patch solder paste printed on the PCB pad, the components f
Technical Library | 1999-05-09 12:51:38.0
This Technical Note outlines, step by step, the easiest ways to remove and replace surface mounted devices, using the lowest possible temperatures. This document discusses the following topics: Removal and replacement of discrete and passive components (capacitors, resistors, SOTs), Removal of two-sided components (SOICs, SOJs, TSOPs), Removal of quad components (PLCCs, QFPs), Replacement of quad components including fine-pitched devices.
The IPC-7711 & 7721 Instructor course is built on a train-the-trainer model. Upon completion of the course, students will know the technical guidelines of IPC-7711 and 7721 and have demonstrated the proficiency necessary to perform rework and repair
The IPC-7711 & 7721 Instructor course is built on a train-the-trainer model. Upon completion of the course, students will know the technical guidelines of IPC-7711 and 7721 and have demonstrated the proficiency necessary to perform rework and repair
Training Courses | | | IPC-7711/7721 Trainer (CIT)
The Certified IPC-7711/7721 Trainer (CIT) courses recognize individuals as qualified trainers in the area of rework and repair of printed boards and electronic assemblies and prepares them to deliver Certified IPC-7711/7721 (CIS) training.
Training Courses | | | IPC-7711/7721 Trainer (CIT) Recert.
The Certified IPC-7711/7721 Trainer (CIT) recertification courses are intended for those individuals who were previously accredited to provide Certified IPC-7711/7721 Trainer (CIS) training.
PCB Libraries, Inc. | https://www.pcblibraries.com/forum/RSS_jedec-standard-footprints_topic2063.xml
... I just assumed is was pay-to-play like IEEE papers.Can you please clarify what you mean by "very few mfr.'s use these"?The parts are created at an IC packaging facility of which several manufacturer's share the same facilities and SOT, SOIC, TSSOP, etc
| http://etasmt.com/cc?ID=te_news_industry,3962&url=_print
); This process is suitable for reflow soldering, in the A side of the PCB B surface wave soldering. In the B-side of the PCB assembly SMD, SOT or SOIC below the pin (28
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