1809 MK5 - Heller Advanced In-Line Vacuum Reflow Oven Nitrogen System with Balanced Flow Technology 9 Top And Bottom Heated Zones - highest zone count per linear foot in the industry! 100" Heated Length - for super throughput! 2 Internal C
Used SMT Equipment | Soldering - Reflow
10 Heat Zones Voltage: 380V Max PCB size: 18" Feed Direction: L-R Additional Options: EHC, Fan Speed Control
Used SMT Equipment | Soldering - Reflow
13 Heat Zones Voltage: 380V Max PCB size: 18" Feed Direction: L-R Additional Options: EHC, Dual Lane, Gen 5.2, OMS
Used SMT Equipment | Soldering - Reflow
10 Heat Zones Voltage: 220V Max PCB size: 18" Feed Direction: L-R Additional Options: EHC, Fan Speed control, Cool Pipe
Used SMT Equipment | Soldering - Reflow
12 Heat Zones Voltage: 400V Max PCB size: 18" Feed Direction: L-R Additional Options: EHC, CBS, CE, Gen 5.1
Used SMT Equipment | Soldering - Reflow
8 Heat Zones Voltage: 480V Max PCB size: 18" Feed Direction: L-R Additional Options: EHC
Used SMT Equipment | Soldering - Reflow
8 Heat Zones Voltage: 480V Max PCB size: 18" Feed Direction: L-R Additional Options: EHC
Used SMT Equipment | Soldering - Reflow
13 Heat Zones Voltage: 480V Max PCB size: 18" Feed Direction: L-R Additional Options: EHC, External Cool
Used SMT Equipment | Soldering - Reflow
8 Heat Zones Voltage: 480V Max PCB size: 18" Feed Direction: L-R Additional Options: EHC, Fan Speed Control
Technical Library | 2023-01-17 17:19:44.0
A test program was developed to evaluate the effectiveness of vacuum reflow processing on solder joint voiding and subsequent thermal cycling performance. Area array package test vehicles were assembled using conventional reflow processing and a solder paste that generated substantial void content in the solder joints. Half of the population of test vehicles then were re-processed (reflowed) using vacuum reflow. Transmission x-ray inspection showed a significant reduction in solder voiding after vacuum processing. The solder attachment reliability of the conventional and vacuum reflowed test vehicles was characterized and compared using two different accelerated thermal cycling profiles. The thermal cycling results are discussed in terms of the general impact of voiding on solder thermal fatigue reliability, results from the open literature, and the evolving industry standards for solder voiding. Recommendations are made for further work based on other void reduction methods and additional reliability studies.
