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Henkel Names New Global Sales Director for Semiconductor Materials

Industry News | 2009-02-02 18:48:47.0

Henkel today announced the appointment of Mr. Luc Godefroid as the company's Global Sales Director for its Semiconductor Group. A key member of Henkel's electronics sales team since 2001, Godefroid's new role sees him building on his previous success and directing the global sales efforts of Henkel's worldwide team and expanded product portfolio.

Heller Industries Inc.

Congressman Rodney Frelinghuysen Visits Heller Industries in New Jersey.

Industry News | 2014-09-06 19:18:17.0

Briefing Co-hosted by IPC as Part of Continuing Effort to Connect IPC Members with Policymakers.

Heller Industries Inc.

Solder Paste Dispensing For Aerospace and Defense

Technical Library | 2023-08-16 18:16:05.0

A global aerospace and defense leader requested a capability test of small volume solder paste dispensing on FR4 circuit boards.

GPD Global

Solder Mask Dispensing For Electronics and Aerostructures

Technical Library | 2023-08-16 18:09:06.0

One of our customers involved with Electronics and Aerostructures requested a test to dispense Techspray Wondermask 2204 solder mask. The dispensing locations include large and small screw holes, single through-hole vias, and connector locations consisting of multiple through-hole vias. The process needed to run quickly and reliably.

GPD Global

Small Volume Solder Paste Dispensing for Aerospace and Defense

Technical Library | 2023-09-07 14:38:31.0

A repeat customer specializing in high-technology interconnect, sensor, and antenna solutions, partnered with us to dispense small volumes of solder paste (Indium 10.1 SAC305 T6SG 78%m) onto backplane connectors – gold pads 0.175mm x 0.225mm. We performed a test requiring 0.200mm diameter or smaller dots to demonstrate the dispensing capability required.

GPD Global

Precision Lead Former for Axial Components (CF8)

Precision Lead Former for Axial Components (CF8)

Videos

Eliminate Body Stress with Versatile CF-8 GPD's CF-8 eliminates component body stress. Versatility is the key word for the CF-8. Simple tooling changes make short or long run production jobs quick and easy. Capabilities Meets exacting military s

GPD Global

Underfill Dispensing For Aerospace Military And Defense

Technical Library | 2023-08-16 18:20:44.0

One of our defense customers planned to dispense underfill material for small and large die, using Hysol FP4545FC epoxy encapsulant. This process dissipates stress on solder joints and prevents cracking and fracturing between the bottom of the die and the surface of the substrate.

GPD Global

Precision Lead Former for Axial Components (CF-8)

Precision Lead Former for Axial Components (CF-8)

New Equipment | Lead Forming

Eliminate Body Stress with Versatile CF-8 GPD's CF-8 eliminates component body stress. Versatility is the key word for the CF-8. Simple tooling changes make short or long run production jobs quick and easy. Capabilities Meets exacting military s

GPD Global

SMT Dispensing Pumps for Integration

SMT Dispensing Pumps for Integration

New Equipment | Dispensing

Retrofit existing system with Innovative Dispensing Technology for Excellent Dispense Control and Repeatability Advanced pump technologies available for retrofitting include: True Volumetric Pump, Precision Auger Pump, Simplified Jetting Pump and Ti

GPD Global

Large / Versatile Board Processing - DS Series Dispenser

Large / Versatile Board Processing - DS Series Dispenser

New Equipment | Dispensing

When Applications Require Large Board Processing &/or Versatility The DS Series of dispensers is a robust, large format platform designed to handle all types of applications with ease. Ideal for dispense applications utilizing adhesive, solder paste

GPD Global


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