Industry News | 2009-12-07 18:05:13.0
Breda, Holland - Cobar BV, a member of the Balver Zinn Group, announces the launch of a whole new range of VOC-free and Low-VOC fluxes at Productronica. Being showcased in Stand 570 in Hall A4, these RoHS compliant fluxes fulfil the need for more environmental-friendly materials, maintaining excellent soldering performance. The event is scheduled to take place 10th – 13th November at the New Munich Trade Fair Center in Munich, Germany.
Industry News | 2019-08-19 22:58:44.0
Seika will showcase a complete line up of leading-edge equipment in Booth #410 at SMTA International. Products includes the latest models from McDry, Sayaka, SAWA, Unitech and MALCOM.
Industry News | 2012-11-06 11:22:15.0
Dispensing and MID (Molded Interconnected Devices) technologies are developing rapidly. Current technology drivers are LED and communication products. On September 28th, Essemtec’s technology day focused on new developments and future challenges. The event was free of charge for all participants.
Technical Library | 2013-03-27 23:43:40.0
Vapor phase, once cast to the annals’ of history is making a comeback. Why? Reflow technology is well developed and has served the industry for many years, it is simple and it is consistent. All points are true – when dealing with the centre section of the bell curve. Today’s PCB manufacturers are faced with many designs which no longer fall into that polite category but rather test the process engineering groups with heavier and larger panels, large ground planes located in tricky places, component mass densities which are poorly distributed, ever changing Pb Free alloys and higher process temperatures. All the time the costs for the panels increase, availability of “process trial” boards diminishes and yields are expected to be extremely high with zero scrap rates. The final process in the assembly line has the capacity to secure all the value of the assembly or destroy it. If a panel is poorly soldered due to poor Oven setup or incorrect programming of the profile the recovery of the panel is at best expensive, at worst a loss. For these challenges people are turning to Vapor Phase.
Industry News | 2019-09-26 12:16:40.0
Saki Corporation will present its 2D and 3D automated optical inspection (AOI) and 3D solder paste inspection (SPI) systems at Productronica India 2019. Productronica India is being held September 25-27 at the India Expo Center, Noida, Delhi, India. Saki technical experts will be available at the following booths: PCI booth PA11, iNETest booth PC11, and Prosem booth PE45.
Industry News | 2019-01-05 16:56:23.0
Metcal today announced plans to exhibit at the 2019 IPC APEX EXPO, scheduled to take place Jan. 29-31, 2019 at the San Diego Convention Center. The company will demonstrate its Connection Validation (CV) Robotic Soldering System, CV Soldering System with new hand-pieces, CV-500 Soldering System and VFX-1000H Volume Fume Extraction System in Booth #1314.
Industry News | 2013-05-01 20:51:31.0
Metcal today announced an additional date for its 2013 Spring series of BGA rework and repair seminars, this time co-hosting with Nikon and Nordson ASYMTEK.
Technical Library | 2017-10-16 15:03:32.0
The miniaturization and advancement of electronic devices have been the driving force of design, research and development, and manufacturing in the electronic industry. However, there are some issues occurred associated with the miniaturization, for examples, warpage and reliability issues. In order to resolve these issues, a lot of research and development have been conducted in the industry and university with the target of moderate melting temperature solder alloys such as m.p. 280°C. These moderate temperature alloys have not resolve these issues yet due to the various limitations. YINCAE has been working on research and development of the materials with lower temperature soldering for higher temperature application. To meet this demand, YINCAE has developed solder joint encapsulant paste to enhance solder joint strength resulting in improving drop and thermal cycling performance to eliminate underfilling, edge bonding or corner bonding process in the board level assembly process. This solder joint encapsulant paste can be used in typical lead-free profile and after reflow the application temperature can be up to over 300C, therefore it also eliminates red glue for double side reflow process. In this paper, we will discuss the reliability such as strength of solder joints, drop test performance and thermal cycling performance using this solder joint encapsulant paste in detail.
Industry News | 2013-03-25 14:54:55.0
Aqueous Technologies, will present a cleaning and reliability workshop to address emerging trends in electronic assembly that have a significant impact on precision cleaning.
Industry News | 2011-09-19 13:33:11.0
Viscom AG is now working with SILGAL IBERICA S.L. as its new representative for the entire Iberian peninsula. SILGAL will represent Viscom throughout Spain and Portugal.
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