High Speed LED Pick and Place Machine If you could not find any similar items you want, you may send some photos to us. because our catalog and website haven't included all of our products. Pick and place machine, SMT pick and place machine, SM
SMT Flexible Pick and Place Machine Flex-6 If you could not find any similar items you want, you may send some photos to us. because our catalog and website haven't included all of our products. Pick and place machine, SMT pick and place mach
New Equipment | Cleaning Equipment
Fully automatic stencil cleaning system MLPBT-750 Application fields of "MLPBT-750 steel mesh cleaning machine": ●Suitable for cleaning various types of stencils such as steel mesh, copper mesh, microporous mesh, and wafer tray [see the following fi
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Parts & Supplies | Assembly Accessories
12MM Calibration Tape .12MM Calibration Tape 20 Inch Folding Bike Ravel Case 20 Inch Folding Bike ravel Case 4*4.1200pcs/bag M0604 8MM Calibration Tape .8MM Calibration Tape 90 degree drive set 90 degree drive set A2E BGA Rework Station Temp Con
DIP Double-side Camera Online AOI Machine ETA-V5300 If you could not find any similar items you want, you may send some photos to us. because our catalog and website haven't included all of our products. solder paste inspection,SMT SPI,SPI mac
Technical Library | 2019-10-21 09:58:50.0
An ACI Technologies customer inquired regarding printed circuit board(PCB) failures that were becoming increasingly prevalent after the SMT (surface mount technology) manufacturing process. The failures were detected by electrical testing, but were undetermined as to the location and specific devices causing the failures. The failures were suspected to be caused predominately in the BGA (ball grid array) devices located on specific sites on this 16 layer construction. Information that was provided on the nature of the failures (i.e., opens or shorts) included high resistance shorts that were occurring in those specified areas. The surface finish was a eutectic HASL (hot air solder leveling) and the solder paste used was a water soluble Sn/Pb(tin/lead).
Technical Library | 2020-05-08 18:22:31.0
A customer contacted the Helpline to perform analysis on a lead-free assembly which exhibited intermittent functionality. The lead-free assembly exhibiting intermittent functionality when pressure was applied to the ball grid array (BGA) packages. Industrial adaptation of a Restriction of Hazardous Substances (RoHS) compliant solder standard has created a new host of failure modes observed in lead-free assemblies. Pad cratering occurs when fractures propagate along the epoxy resin layer on the underside of the BGA connecting pads. While originating from process, design, and end use conditions, it is the combination of a rigid lead-free solder with inflexible printed circuit board (PCB) laminates that has advanced the prevalence of this condition. Pad cratering is simply the result of mechanical stress exceeding material limitations.
ETA DIP Inverted Camera Online AOI Machine ETA-V5200 If you could not find any similar items you want, you may send some photos to us. because our catalog and website haven't included all of our products. solder paste inspection,SMT SPI,SPI m
New Equipment | Test Equipment
1200MM/1500MM Online SPI , Big Size Solder Paste Inspection Machine mail: sales@smtlinemachine.com whatapp/wechat:+8613537875415 Specification: 技术参数/Parameters 技术平台/Technology Platform super big size platform 适用
Industry News | 2009-06-11 12:25:44.0
Company Expands Training Services
