Full Site - : solder ball after reflow ws 488 (Page 3 of 47)

BGA X-Ray Inspection

BGA X-Ray Inspection

Videos

BEST's BGA x-ray inspection capabilities are shown as one of the x-ray techs "drives around" the BGA after BGA rework. During BGA x-ray inspection the first view is a macro one followed by zooming in and examing each area closely. Look at our BGA X-

BEST Inc.

BGA Reballing Services

BGA Reballing Services

Videos

EZReball demonstration video. Simple and Fast new reball method! The new BEST EZReball™ process is an answer to your reballing problems. This unique method simplifies the reballing process allowing for better yields and faster reballing times. http:

BEST Inc.

BGA Rework Service and Repair Services By BEST, Inc.

BGA Rework Service and Repair Services By BEST, Inc.

Videos

This video describes the BEST BGA rework and BGA rework services capabilities. What is described in this movie are the people, processes and tools unique to BEST and how that impacts its customers. The advanced equipment set including multiple refl

BEST Inc.

Reballing Preforms Now in 3 Days

Industry News | 2013-09-03 11:52:21.0

BEST's EZReball(TM) reballing preforms now are available as standard in 3 business days. Expedited packs are in available in 24 hours to help you with your reballing projects

BEST Inc.

Manncorp's 6,400 CPH dual-head MC-392 pick-and-place features ball screw X-Y and 30um, 3 sigma accuracy

Industry News | 2010-12-01 13:36:54.0

Although all five models in Manncorp’s latest-generation MC series pick-and-place systems have received industry acclaim, one system in particular has stood out for its extraordinary price/performance ratio, according to CEO Henry Mann.

Manncorp

AOI offline inspection after PCB assembly

AOI offline inspection after PCB assembly

Videos

AOI technology has been proven as highly efficient for PCB manufacturing process improvement and quality achievement. EKT strives to be your most reliable AOI supplier. cathysun@ekt-tech.com mb/wechat: +86-18320811289

EKTION (SHENZHEN) TECHNOLOGY LIMITED

Reliability of BGA Solder Joints after Re-Balling Process

Technical Library | 2012-10-04 18:52:43.0

First published in the 2012 IPC APEX EXPO technical conference proceedings... Due to the obsolescence of SnPb BGA components, electronics manufacturers that use SnPb solder paste either have to use lead-free BGAs and adjust the reflow process or re-ball t

Mat-tech

FCT Assembly Introduces WS177 Lead-Free, Water-Soluble Solder Paste

Industry News | 2009-05-20 19:17:30.0

GREELEY, CO �FCT Assembly introduces WS177 lead-free water-soluble solder paste featuring its latest technology in print and reflow of paste in the water-soluble category for lead-free alloys.

FCT ASSEMBLY, INC.

FCT Assembly Premiers WS159 Tin-Lead Water-Soluble Solder Paste

Industry News | 2009-05-18 17:19:51.0

GREELEY, CO - FCT Assembly debuts WS159 water-soluble solder paste, featuring FCT's latest technology in print and reflow of paste in the water soluble category.

FCT ASSEMBLY, INC.

SIPAD Systems Inc.

Industry Directory | Manufacturer

The exclusive supplier of SIPAD Solid Solder Deposit in North America and the only SIPAD Solid Solder Deposit (SSD) coating service bureau in the world.


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