Electronics Forum | Thu Jan 18 21:52:24 EST 2001 | arul2000
>>>>Dave, The BGA substrate surface finish is NiAu, while the PCBA pad surface is HASL. The solder ball composition is SnPb 63/37 and the solder paste used on the PCBA is also the same but with 2% Silver.>>> Dave, sorry I don't have the picture with
Electronics Forum | Mon Aug 16 04:55:30 EDT 2004 | roel
Concerning the solder-balls, there are a few causes for this. Try to slow down your solder-speed (P.e 80cm/min). Can you measure temperature after the pre-heat zone? Are there also blow-holes in the joints? Personally I think there is some water in t
Electronics Forum | Sat Oct 31 10:56:16 EST 1998 | Dennis Barry
| I finally got my problem figured out on the bridging, the | only thing I'm finding is that I notice some litlte solder balls on the bottom of the board. Is that normal? Is that why I'm getting bridges? Has anyone came across this problem and pass t
Electronics Forum | Mon Aug 04 16:20:35 EDT 2008 | patrickbruneel
After analyzing the pictures I don't think the solder balls are caused by the solder mask. If the problem would be solder mask related the solder balls would only show up on the solder mask but there are also solder balls on the plastic tabs. To me i
Electronics Forum | Fri Oct 30 18:08:59 EST 1998 | Dave F
| I finally got my problem figured out on the bridging, the | only thing I'm finding is that I notice some litlte solder balls on the bottom of the board. Is that normal? Is that why I'm getting bridges? Has anyone came across this problem and pass t
Electronics Forum | Tue Feb 27 22:04:45 EST 2001 | hany_khoga
Dear all: I need to know why do I find a lot of solder balles every where on the solder side of my assemblies after coming out of the wave solder machine. How can I avoid this? Thanks Hany
Electronics Forum | Tue Dec 10 14:10:38 EST 2002 | Randy Villeneuve
Steve, I wave solder most if not all our boards with selective wave pallets. I did not catch if the solder balls were on top of the board or on the bottom but that will make a difference on what to do to get rid of them. Pallets are good and bad. On
Electronics Forum | Thu May 26 16:41:00 EDT 2011 | scottp
Here's what I do: - Test Surface Insulation Resistance (we're in the high reliability market and use a test significantly harder than IPC's). I also test SIR in combination with other assembly materials like conformal coatings and wave solder flux
Electronics Forum | Sun Apr 11 11:39:52 EDT 2010 | manchella
When we have sent some of motherboards for reliability testing in a tird party laoratory. It is found that when Dye&Pry is done after 600 cycles of Thermal Cycling, in LGA socket only one of the corner solder joing had 100% type 3 crack. All other so
Electronics Forum | Tue Dec 29 04:11:59 EST 1998 | Richard Sin
I have an inbteresting problem on my N2 wave soldering lines. We have two N2 wave soldering line. Line A is old one and Line B is new. We found solder balling Phenomenon on PCB After soldering in the new N2 Atmosphere Wave Soldering Machine. In the c
