Technical Library | 2023-01-17 17:22:28.0
The impact of voiding on the solder joint integrity of ball grid arrays (BGAs)/chip scale packages (CSPs) can be a topic of lengthy and energetic discussion. Detailed industry investigations have shown that voids have little effect on solder joint integrity unless they fall into specific location/geometry configurations. These investigations have focused on thermal cycle testing at 0°C-100°C, which is typically used to evaluate commercial electronic products. This paper documents an investigation to determine the impact of voids in BGA and CSP components using thermal cycle testing (-55°C to +125°C) in accordance with the IPC- 9701 specification for tin/lead solder alloys. This temperature range is more typical of military and other high performance product use environments. A proposed BGA void requirement revision for the IPC-JSTD-001 specification will be extracted from the results analysis.
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Industry News | 2003-01-27 10:27:31.0
At a New Facility Within the Company's U.S. Headquarters
Industry News | 2015-06-11 16:02:18.0
MIRTEC, "The Global Leader in Inspection Technology," will exhibit its most recent solutions for System in Package (SiP) inspection and measurement at SEMICON WEST 2015; July 14-16, 2015, at the Moscone Center in San Francisco, CA. Visitors are invited to booth # 2343 for a detailed demonstration of this exciting new technology.
Industry News | 2003-06-10 08:39:25.0
New from Unitek Eapro is a series of desktop systems for hot bar bonding applications.
Industry News | 2014-09-30 18:49:51.0
MIRTEC, “The Global Leader in Inspection Technology,” announces that it was awarded a 2014 Global Technology Award in the category of LED Production Equipment for its MV-9XP LED Package Inspection System.
Industry News | 2014-06-22 19:12:37.0
MIRTEC, “The Global Leader in Inspection Technology,” will exhibit in Booth #5444-1 at SEMICON West 2014, scheduled to take place July 8-10 at the Moscone Center in San Francisco, CA.
Industry News | 2013-11-13 12:39:14.0
MIRTEC, “The Global Leader in Inspection Technology,” announces that it was awarded a 2013 Global Technology Award in the category of LED Production Equipment for its MV-9XP LED Package Inspection System.
Industry News | 2012-01-23 00:02:12.0
MIRTEC, “The Global Leader in Inspection Technology”, will premier its complete line of 3D AOI, SPI, X-ray and LED inspection systems at the IPC APEX Expo in booth #3637.
Industry News | 2005-09-19 16:07:56.0
No higher temperature and No process changes needed
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