Full Site - : solder ball electrical clearance (Page 7 of 34)

YesTech YTV-F1

YesTech YTV-F1

Used SMT Equipment | AOI / Automated Optical Inspection

Yestech YTV-F1 AOI Model: YTV-F1 Vintage: 2008 Good Functional Condition Cameras: 6 (1 top view + 1 High mag. + 4 side cameras) [2 of side cameras are inactive] High Mag Camera Option Stadium Lighting (White+Red+Blue+Green LEDS) Software: YesV

LEL Tech

ATE Spring Pin BGA Socket for Digital Camera Processor

Industry News | 2011-01-12 15:27:11.0

Ironwood Electronics recently introduced a new BGA socket addressing high performance requirements for testing digital camera processor - CBT-BGA-7005. The contactor is a stamped spring pin with 26 gram actuation force per ball and cycle life of 500,000 insertions.

Ironwood Electronics

Stereo Vision Based Automated Solder Ball Height Detection

Technical Library | 2015-04-16 16:11:43.0

Solder ball height inspection is essential to the detection of potential connectivity issues in semi-conductor units. Current ball height inspection tools such as laser profiling, fringe projection and confocal microscopy are expensive, require complicated setup and are slow, which makes them difficult to use in a real-time manufacturing setting. Therefore, a reliable, in-line ball height measurement method is needed for inspecting units undergoing assembly. (...) In this paper, an automatic, stereo vision based, in-line ball height inspection method is presented. The proposed method includes an imaging setup together with a computer vision algorithm for reliable, in-line ball height measurement.

Intel Corporation

Omron VT-RNS2-L3

Omron VT-RNS2-L3

Used SMT Equipment | AOI / Automated Optical Inspection

R Front Rail Fixed Application Version: 7.20C (RNS) Ladder Version: 7.100B (RNS) Image Resolution: 15um AC 120V, 2 Phase, 50/60 Hz, 1.5 kVA Max Current: 15A Hardware Configuration: Image Signal Input Unit: - Camera: 3-CCD Camera - Illumi

Tekmart International Inc.

Agilent Full-automatic BGA Ball Mounti

Agilent Full-automatic BGA Ball Mounti

Parts & Supplies | Repair/Rework

main features The full-automatic BGA Ball Mounting machine PG-FA6800 is composed of IPC control system, high-speed 12 axis motion control system, high definition Vision inspection system, convenient operation system, and automatic orientation contr

Goodluck Electronic Equipment Co.,Ltd

Agilent Full-automatic BGA Ball Mounti

Agilent Full-automatic BGA Ball Mounti

Parts & Supplies | Repair/Rework

main features The full-automatic BGA Ball Mounting machine PG-FA6800 is composed of IPC control system, high-speed 12 axis motion control system, high definition Vision inspection system, convenient operation system, and automatic orientation contr

Goodluck Electronic Equipment Co.,Ltd

Pad Cratering Susceptibility Testing with Acoustic Emission

Technical Library | 2015-08-13 15:52:40.0

Pad cratering has become more prevalent with the switch to lead free solders and lead free compatible laminates. This mainly is due to the use of higher reflow temperature, stiffer Pb-free solder alloys, and the more brittle Pb-free compatible laminates. However, pad cratering is difficult to detect by monitoring electric resistance since pad cratering initiates before an electrical failure occurs. Several methods have been developed to evaluate laminate materials' resistance to pad cratering. Pad-solder level tests include ball shear, ball pull and pin pull. The detailed methods for ball shear, ball pull, and pin pull testing are documented in an industry standard IPC-9708. Bansal, et al. proposed to use acoustic emission (AE) sensors to detect pad cratering during four-point bend test. Currently there is an industry-working group working on test guidelines for acoustic emission measurement during mechanical testing.

Agilent Technologies, Inc.

X2 2D X-Ray - Automated In-line X-Ray Inspection System

X2 2D X-Ray - Automated In-line X-Ray Inspection System

New Equipment | Inspection

Automated 2D inspection Unsurpassed image quality Highest defect detection, low false calls Fast throughput Quick set-up Cost effective Nordson YESTECH’s versatile X2 Automated 2D X-Ray Inspection System (AXI) offers complete i

Nordson YESTECH

Head-in-Pillow BGA Defects

Technical Library | 2009-11-05 11:17:32.0

Head-in-pillow (HiP), also known as ball-and-socket, is a solder joint defect where the solder paste deposit wets the pad, but does not fully wet the ball. This results in a solder joint with enough of a connection to have electrical integrity, but lacking sufficient mechanical strength. Due to the lack of solder joint strength, these components may fail with very little mechanical or thermal stress. This potentially costly defect is not usually detected in functional testing, and only shows up as a failure in the field after the assembly has been exposed to some physical or thermal stress.

AIM Solder

Technology Seminars, Inc.

Industry Directory | Consultant / Service Provider

Serving the Educational Needs of Modern Technologies


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