Industry Directory | Consultant / Service Provider / Manufacturer
WinTronics is a full service, ISO 9001:2000 certified, electronics and electro-mechanical contract manufacturer supporting customers in the commercial, industrial, automotive, Home Land Security, and military markets.
Career Center | Houston, Texas USA | Production
Electronic Assemblers / Solderers Temp to hire opportunity! $11 - $13/hour Job Responsibilities 1.) Solder rf, gps and gsm antenna, ps pigtail, fiber leds, buzzer 2.) IPC-610 or mil spec experience a plus 3.) Glue units together 4.) Cut open
Career Center | , | 2018-02-22 12:50:43.0
Job Description: • Performs a variety of tasks ranging from repetitive to non-repetitive production assembly operations on printed circuit card assemblies. • Ability to work from diagrams and drawings, make initial layouts, and use hand and/or pow
Career Center | , | 2018-02-22 12:51:59.0
Job Description: • Performs a variety of tasks ranging from repetitive to non-repetitive production assembly operations on printed circuit card assemblies. • Ability to work from diagrams and drawings, make initial layouts, and use hand and/or pow
Career Center | , | 2018-02-22 12:55:54.0
Job Description: • Performs a variety of tasks ranging from repetitive to non-repetitive production assembly operations on printed circuit card assemblies. • Ability to work from diagrams and drawings, make initial layouts, and use hand and/or po
Technical Library | 2016-11-30 21:30:50.0
Mid-chip solder balling is a defect typically associated with solder paste exhibiting poor hot slump and/or insufficient wetting during the reflow soldering process, resulting in paste flowing under the component or onto the solder resist. Once molten, this solder is compressed and forced to the side of the component, causing mid-chip solder balling.This paper documents the experimental work performed to further understand the impact on mid-chip solder balling from both the manufacturing process and the flux chemistry.
Sn-Zn-Al, Sn-Zn-3Bi, Features; Luster/Strong Joint, Melting Temp. 199C, �80-760�m
Sn-Ag-Cu, Sn-Cu, Features; for High Temp Application, Melting Temp. 220-227C, �80-760�m
New Equipment | Solder Materials
High Reliability Lead-Free Solder Spheres SN100C. eBall Selection: Impact Strength SN100C (Sn-Cu-Ni+Ge) Solder spheres with excellent impact strength, suitable for BGA, CSP, MCM and high density fine pitch
Career Center | Kirkland, Portsmouth N.H Canada | Quality Control
Contract Electronic Manufacturer of PCB Assemblies seeks experienced QA Inspector with CLUSO VISION SYSTEMS First Article Inspection experience. Excellent communication skills. Computer literate, strong sense of urgency, and motivated with good follo
