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Solderer

Career Center | Eden Prairie, Minnesota USA | Production

Solderer ALL SHIFTS Logic PD collaborates with clients to help them launch products that accelerate growth and capture value in the Internet of Things (IoT). Logic PD helps at any stage in the product lifecycle by being the complete product innovat

Logic PD, Inc.

Low Cycle Fatigue Behaviour of Multi-joint Sample in Mechanical Testing

Technical Library | 2013-03-21 21:24:49.0

This paper explores the behaviour of a copper test vehicle with multiple reflowed solder joints, which has direct relevance to ball grid arrays (BGA) and high density interconnect structures. The paper explores the relative stress conditions on the distributed joints and the sensitivity to ball joint shape... First published in the 2012 IPC APEX EXPO technical conference proceedings

National Physical Laboratory

Altek Electronics, Inc. Purchases Ersa’s Smartflow Selective Soldering System

Industry News | 2018-02-15 20:01:43.0

Kurtz Ersa North America has purchased and successfully installed the Smartflow 2020 selective soldering system. A veteran-owned small business privately held by three family members (Stephen, David and Sabrina), Altek manufactures printed circuit board assemblies and box builds for many industries including the medical, military, industrial and telecommunications industries.

kurtz ersa Corporation

Selective soldering in an optimized nitrogen atmosphere

Technical Library | 2021-09-29 13:35:21.0

In PCB circuit assemblies the trend is moving to more SMD components with finer pitch connections. The majority of the assemblies still have a small amount of through hole (THT) components. Some of them can't withstand high reflow temperatures, while others are there because of their mechanical robustness. In automotive applications these THT components are also present. Many products for cars, including steering units, radio and navigation, and air compressors also use THT technology to connect board-to-board, PCB's to metal shields or housings out of plastic or even aluminium. This is not a simple 2D plain soldering technology, as it requires handling, efficient thermal heating and handling of heavy (up to 10 kg) parts. Soldering technology becomes more 3D where connections have to be made on different levels. For this technology robots using solder wire fail because of the spattering of the flux in the wires and the long cycle time. In wave soldering using pallets the wave height is limited and pin in paste reflow is only a 2D application with space limitations. Selective soldering using dedicated plates with nozzles on the solder area is the preferred way to make these connections. All joints can be soldered in one dip resulting in short cycle times. Additional soldering on a small select nozzle can make the system even more flexible. The soldering can only be successful when there is enough thermal heat in the assembly before the solder touches the board. A forced convection preheat is a must for many applications to bring enough heat into the metal and board materials. The challenge in a dip soldering process is to get a sufficient hole fill without bridging and minimize the number of solder balls. A new cover was designed to improve the nitrogen environment. Reducing oxygen levels benefits the wetting, but increases the risk for solder balling. Previous investigations showed that solder balling can be minimized by selecting proper materials for solder resist and flux.

Vitronics Soltec

Whitepaper Discusses Critical Process Steps for High-Reliability BGA Device Re-balling

Industry News | 2023-07-19 09:52:10.0

The re-balling of BGA components from lead-free to tin-lead solder is a critical requirement by some high-reliability customer applications due to tin-whisker mitigation concerns. This technical paper by Circuit Technology Center discusses the key process steps of this highly specialized process.

Circuit Technology Center, Inc.

Seika Machinery Introduces PR1 Pocket Handy BGA Solder Ball Checker

Industry News | 2010-05-29 18:01:49.0

TORRANCE, CA — Seika Machinery, Inc., a leading provider of advanced machinery, materials and engineering services, introduces M.S. Engineering Co. Ltd.’s PR1 BGA Solder Ball Checker for fast and accurate inspection of BGA soldering and QFP lead sections.

Seika Machinery, Inc.

JOT Optical BGA Rework Station PG-

JOT Optical BGA Rework Station PG-

Parts & Supplies | Repair/Rework

PG-P6860 Main Features: 1、 The top heater can move freely along the X, Y axis in the IR preheating area. It is good for many BGA chips distribution at different positions in the PCB board which need repair. X-shaped infrared laser can do rapid lo

Goodluck Electronic Equipment Co.,Ltd

JOT Optical BGA Rework Station

JOT Optical BGA Rework Station

Parts & Supplies | Repair/Rework

PG-P6800 Main Features: 1、There are 3 independent heaters. The 1st and 2nd hot-air heaters can control multiple groups and segments temperature parameters. The 2nd heater can move up and down. The 3rd large area IR heater can preheat the PCB boar

Goodluck Electronic Equipment Co.,Ltd

Bob Willis On Site Theory or Hands On Workshops

Bob Willis On Site Theory or Hands On Workshops

New Equipment | Education/Training

All Bob Willis training workshops are run on site at your manufacturing facility, conference or exhibition venues Worldwide. We offer the largest range of theory and hands on workshops in the industry. The content of any workshop may be modified to s

ASKbobwillis.com

X2 2D X-Ray - Automated In-line X-Ray Inspection System

X2 2D X-Ray - Automated In-line X-Ray Inspection System

New Equipment | Inspection

Automated 2D inspection Unsurpassed image quality Highest defect detection, low false calls Fast throughput Quick set-up Cost effective Nordson YESTECH’s versatile X2 Automated 2D X-Ray Inspection System (AXI) offers complete i

Nordson YESTECH


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