This video presents a general overview of ORPRO Vision's AOI during test. Video captured at Tremol SMD in Bulgaria. For additional information, please contact ORPRO Vision at sales.us@orprovision.com sales.eu@orprovision.com Visit our website: www
Advanced semiconductor packaging and high precision SMT assembly convergence. Galaxy unites advanced semiconductor packaging and high precision next-generation SMT assembly on the same platform. This level of convergence delivers the advanced techno
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Zetech was established in 1986 with the intention of supplying Industrial Equipment, Manufacturing Equipment, Consumable Materials, Software and Technical Support to the Electronics and Manufacturing Industry in South Africa.
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Technical Library | 2014-03-06 19:04:07.0
Over the last few years, there has been an increase in the rate of Head-in-Pillow component soldering defects which interrupts the merger of the BGA/CSP component solder spheres with the molten solder paste during reflow. The issue has occurred across a broad segment of industries including consumer, telecom and military. There are many reasons for this issue such as warpage issues of the component or board, ball co-planarity issues for BGA/CSP components and non-wetting of the component based on contamination or excessive oxidation of the component coating. The issue has been found to occur not only on lead-free soldered assemblies where the increased soldering temperatures may give rise to increase component/board warpage but also on tin-lead soldered assemblies.
Industry News | 2019-11-03 15:27:58.0
Weller Tools announces that it is providing two soldering stations to support the SMTA Space Coast Chapter’s Third Annual Soldering Challenge at the upcoming exhibition and Tech Forum. The event will take place at 1 p.m. on November 20 at the Melbourne Auditorium in Melbourne, FL.
New Equipment | Solder Materials
With a variety of formulations for various wave soldering processes, MULTICORE brand high performance liquid flux technology is compatible with dual-wave and lead-free processes, delivering outstanding results. From no-clean to low-residue to VOC-f
Industry News | 2009-08-19 13:06:06.0
Extending its capabilities for placing solder spheres at high speed, DEK’s proven DirEKt Ball Placement™ process now enables accurate solder sphere deposition for spheres as small as 200µm in diameter with pitches as tight as 300µm. With the ability to achieve this accuracy and precision at a first pass yield of over 99.99%, DirEKt Ball Placement delivers the speeds necessary for modern package manufacture without sacrificing anything in the way of performance.
Industry News | 2018-11-06 10:44:06.0
Koh Young Technology reached an impressive milestone recently when the 13,000th inspection system Zenith 2 Automatic Optical Inspection (AOI) was delivered to wenglor sensoric GmbH, Germany. The Zenith series measures the true profilometric shape of components, solder joints and even foreign material on assembled PCBs with true three-dimensional accuracy and with comprehensive IPC-610 comparison.
Automated 2D & 3D inspection Unsurpassed image quality High defect detection Low false calls Fast throughput Quick set-up Nordson YESTECH's versatile X3 Automated X-Ray Inspection Systems (AXI) offers complete inspection of sol
