Industry Directory: solder ball ipc-610 (40)

DONGGUAN KINGSUN AUTOMATION TECHNOLOGY CO.,LTD

DONGGUAN KINGSUN AUTOMATION TECHNOLOGY CO.,LTD

Industry Directory | Consultant / Service Provider / Distributor / Equipment Dealer / Broker / Auctions / Manufacturer / Manufacturer's Representative

DONGGUAN KINGSUN AUTOMATION TECHNOLOGY CO.,LTD is a company which mainly provide used and new SMT parts, provide repair SMT key parts service,new/used SMT machine trading,SMT consumables and Peripherals equipment,Clean room, ESD..

EPTAC Corporation

EPTAC Corporation

Industry Directory | Standards Setting / Certification / Training Provider

EPTAC is an internationally recognized solder training and IPC certification corporation, giving professionals the skills to accelerate their careers, and businesses the talent to succeed.

New SMT Equipment: solder ball ipc-610 (135)

BGA Reballing Service

BGA Reballing Service

New Equipment | Rework & Repair Services

BGA Reballing and Solder Bumping for all types of SMD's Lead, Lead Free and Solder Alloy Conversion. Package types include but are not limited to: PBGA (Plastic Ball Grid Array) TBGA (Tape Ball Grid Array) uBGA (Micro BGA) CCGA (Ceramic Colum

Precision PCB Services, Inc

BGA Reballing Training

New Equipment | Education/Training

In this One-Day class you will learn successful techniques to re-ball BGA Components.  Both Lead and Lead Free Solder Balls will be covered.  The student will have an opportunity to use and evaluate some of the most popular BGA rework fixtures on the

Precision PCB Services, Inc

Electronics Forum: solder ball ipc-610 (2236)

minimum solder ball (bead) size

Electronics Forum | Tue Jun 06 11:57:12 EDT 2006 | Chunks

IPC 610 says acceptable Class 1 (Class 2, 3 indicator) if they are entrapped/encpsulated balls within 0.13mm of lands or pads. or exceed 0.13mm in diameter. Defect Class 1,2,3: Solder ball violates min electrical clearance. Solder balls not entrap

solder ball

Electronics Forum | Tue Jun 04 22:54:32 EDT 2002 | davef

Solder balls are one of the most popular topics here on SMTnet. Search the fine SMTnet Archives for background. We like to wash solder balls from the board in our cleaner.

Used SMT Equipment: solder ball ipc-610 (15)

YesTech YTV-F1

YesTech YTV-F1

Used SMT Equipment | AOI / Automated Optical Inspection

YesTech YTV-F1 Automated PCB Inspection System >Multi-function all purpose In-Line system • (2) Top-down Cameras; Incl. (1) High Magnification • (4) side viewing cameras • LED top light, bi-color multiangle LED lighting •

Baja Bid

YesTech YTV-F1

YesTech YTV-F1

Used SMT Equipment | AOI / Automated Optical Inspection

YesTech YTV-F1 Automated PCB Inspection System >Multi-function all purpose In-Line system • (2) Top-down Cameras; Incl. (1) High Magnification • (4) side viewing cameras • LED top light, bi-color multiangle LED lighting •

Baja Bid

Industry News: solder ball ipc-610 (538)

Parts & Supplies: solder ball ipc-610 (35)

Yamaha Automatic PCB Lead Cutter

Parts & Supplies | Other Equipment

Automtaic PCB Lead Cutter, Lead Cutting Machine   FEATHERS    The eagle claw shrapnel clamp can nip PC boards tightly and push them forward automatically and stably. The track board-delivery speed can be adjusted according to pins to increase t

Qinyi Electronics Co.,Ltd

Yamaha Automatic PCB Lead Cutter

Yamaha Automatic PCB Lead Cutter

Parts & Supplies | Other Equipment

Automtaic PCB Lead Cutter, Lead Cutting Machine   FEATHERS    The eagle claw shrapnel clamp can nip PC boards tightly and push them forward automatically and stably. The track board-delivery speed can be adjusted according to pins to increase t

Qinyi Electronics Co.,Ltd

Technical Library: solder ball ipc-610 (44)

THE LAST WILL AND TESTAMENT OF THE BGA VOID

Technical Library | 2023-01-17 17:22:28.0

The impact of voiding on the solder joint integrity of ball grid arrays (BGAs)/chip scale packages (CSPs) can be a topic of lengthy and energetic discussion. Detailed industry investigations have shown that voids have little effect on solder joint integrity unless they fall into specific location/geometry configurations. These investigations have focused on thermal cycle testing at 0°C-100°C, which is typically used to evaluate commercial electronic products. This paper documents an investigation to determine the impact of voids in BGA and CSP components using thermal cycle testing (-55°C to +125°C) in accordance with the IPC- 9701 specification for tin/lead solder alloys. This temperature range is more typical of military and other high performance product use environments. A proposed BGA void requirement revision for the IPC-JSTD-001 specification will be extracted from the results analysis.

Heller Industries Inc.

Surface Insulation Resistance (SIR) Testing

Technical Library | 2007-02-01 09:36:26.0

Purpose: Compare the Surface Insulation Resistance of reworked BGA Test samples made with standard solder balls using a flux only reattachment and samples made including the StencilQuik™ product from Best Inc. with solder balls using a flux only reattachment.

BEST Inc.

Videos: solder ball ipc-610 (96)

Shuttle Star BGA Rework Station Features Side View Camera

Shuttle Star BGA Rework Station Features Side View Camera

Videos

BGA component installation demo with the Shuttle Star SV560 that has the Side View Camera option.

Precision PCB Services, Inc

Precision PCB Services, Inc. Introduces Side View Camera for BGA Inspection

Precision PCB Services, Inc. Introduces Side View Camera for BGA Inspection

Videos

Amid the COVID 19 crisis, Precision PCB Sevices, Inc. remains open and cable to provide quick turn BGA Rework and Reballing Services with offices in Northern Californa and Dallas, Texas. Today are introducing our new Side View Camera for BGA Rework

Precision PCB Services, Inc

Training Courses: solder ball ipc-610 (16)

BGA Reballing Seminar

Training Courses | | | PCB Rework and Hand Soldering Courses

The PCB rework and hand soldering courses courses cover techniques of rework and repair of PCBs, BGAs and other electronics assemblies, and teach fundamentals of soldering of electronics assemblies.

Precision PCB Services, Inc

BGA Reballing Seminar

Training Courses | | | PCB Rework and Hand Soldering Courses

The PCB rework and hand soldering courses courses cover techniques of rework and repair of PCBs, BGAs and other electronics assemblies, and teach fundamentals of soldering of electronics assemblies.

Precision PCB Services, Inc

Events Calendar: solder ball ipc-610 (8)

IPC Tech Ed Webinar Series: Ball Grid Array (BGA) and Bottom Termination Component (BTC) Design and Assembly Challenges: Reflow Profiling to Achieve Low Defect Rates and Successful Assembly! – Part 2

Events Calendar | Thu Oct 03 00:00:00 EDT 2019 - Thu Oct 03 00:00:00 EDT 2019 | ,

IPC Tech Ed Webinar Series: Ball Grid Array (BGA) and Bottom Termination Component (BTC) Design and Assembly Challenges: Reflow Profiling to Achieve Low Defect Rates and Successful Assembly! – Part 2

Association Connecting Electronics Industries (IPC)

Ball Grid Array Rework - How to Do It Successfully

Events Calendar | Mon May 04 00:00:00 EDT 2020 - Mon May 04 00:00:00 EDT 2020 | ,

Ball Grid Array Rework - How to Do It Successfully

Surface Mount Technology Association (SMTA)

Career Center - Jobs: solder ball ipc-610 (40)

Materials Engineer and Lab Supervisor

Career Center | Milpitas, California USA | Clerical,Production,Quality Control,Research and Development,Technical Support

Winslow Automation, Inc. (aka Six Sigma), an industry leader in electronic component interconnect technology & related test and failure analysis services, is seeking a ‘hands on’ Materials Engineer to join our Test services team. This individual wi

Winslow Automation (aka Six Sigma)

Assembler 2 – IPC 610 – 1st Shift

Career Center | Oldsmar, Florida USA | Engineering,Maintenance,Production

Job Title: Assembler 2 – IPC 610 – 1st Shift Address: 3655 Tampa Rd, Oldsmar FL 34677 Duration: 1 year Pay Rate: $15-$18 Hours: 9/80 schedule Monday – Thursday 6:00AM – 3:30PM, Friday 6:00AM to 2:30PM Job Description: Use microscope to verify

Lockheed Martin Corporation

Career Center - Resumes: solder ball ipc-610 (26)

Process Engineer

Career Center | san diego,, California USA | Engineering,Production,Quality Control,Technical Support

SMT Process Engineer, ISO-9001, IPC-600/610/620/7711/7721, J-STD-001, Thermal profiling, Lean manufacturing.

SMT TECH/ ENGINEER

Career Center | ORLANDO, Florida USA | Engineering,Maintenance,Production,Technical Support

Manufacturing tech/eng for a contract manufacture for 10+ years. Been working in the SMT industry for a total of 20yrs. Have done everything from operator to process work. Most familiar with Assembleon, MPM, DEK, BTU,Electrovert, SLIM-KIC, SUPER-MOLE

Express Newsletter: solder ball ipc-610 (981)

SMT Express, Volume 2, Issue No. 3 - from SMTnet.com

SMT Express, Volume 2, Issue No. 3 - from SMTnet.com Volume 2, Issue No. 3 Thursday, March 16, 2000 Featured Article Return to Front Page Curtailing Voids in Fine Pitch Ball Grid Array Solder Joints by Gary Morrison and Kevin Lyne

Partner Websites: solder ball ipc-610 (992)

The Importance of IPC-A-610 Certification

| https://www.eptac.com/blog/the-importance-of-ipc-a-610-certification?hsLang=en

The Importance of IPC-A-610 Certification Looking for solder training standards, manuals, kits, and more? Visit soldertraining.com Training Training Materials Locations Resources Ask Helena

How to Prevent a Solder Ball Defect | Imagineering, Inc.

Imagineering, Inc. | https://www.pcbnet.com/blog/how-to-prevent-a-solder-ball-defect/

. Per the IPC-A-610 , a PCB with more than 5 solder balls (<=0.13mm) within 600mm² is defective, as a diameter larger than 0.13mm violates the minimum electrical clearance principle

Imagineering, Inc.


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