Full Site - : solder ball minimum electrical clearance smt (Page 16 of 32)

ESSEMTEC to Highlight Flexible Swiss Made Solutions at IPC/APEX 2011

Industry News | 2011-03-02 17:28:40.0

Essemtec announces that it will feature a range of new equipment in Booth #773 at the upcoming IPC APEX EXPO, scheduled to take place April 12-14, 2011 at the Mandalay Bay Resort & Convention Center in Las Vegas.

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Juki YB PULLEY PN:40000723

Juki YB PULLEY PN:40000723

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JUKI 2050(2060) YB PULLEY BRACKET R ASSY PN:40000723 SHENZHEN GREEN TECHNOLOGY Company was found in 2003.we are specialized in the field of Industrial PC boards and Electronic controls Repair,and supply SMT/AI spare parts. Our company main busi

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Juki FX-1(FX-1R) T MOTOR HC-BH0136L

Juki FX-1(FX-1R) T MOTOR HC-BH0136L

Parts & Supplies | Pick and Place/Feeders

Supply&repair all juki spare parts at a lower price: JUKI 730(740) T MOTOR L402-021EL0 JUKI 730(740) Z MOTOR L404-151EL8 JUKI 750(760) C THETA MOTOR E93107250A0 P50B0300PXS22 JUKI 750(760) CZ HEAD MOTOR E93117250A0 P50B03003PXS22 JUKI 750(7

FUJINTAI TECHNOLOGY CO.,LIMITED

Juki 750(760) SUB-CPU E86017210B0

Juki 750(760) SUB-CPU E86017210B0

Parts & Supplies | Pick and Place/Feeders

Used juki 750 SUB-CPU CARD available for sale. SHENZHEN GREEN TECHNOLOGY Company was found in 2003.we are specialized in the field of Industrial PC boards and Electronic controls Repair,and supply SMT/AI spare parts. Here are some of the item

FUJINTAI Technology Co.,Ltd

CSP assembly compliance to IPC-A-610 minimum electrical clearance

Electronics Forum | Wed Sep 12 03:52:45 EDT 2018 | shascoet29

Hi, Is the IPC-A-610 applicable to CSP assemblies? Especially regarding the solder ball to solder ball distance versus the minimum electrical clearance for assembly(0.13mm/IPC-A-610). With a 0.4mm pitch component and 260 microns diameters balls, thi

minimum solder ball (bead) size

Electronics Forum | Tue Jun 06 11:57:12 EDT 2006 | Chunks

IPC 610 says acceptable Class 1 (Class 2, 3 indicator) if they are entrapped/encpsulated balls within 0.13mm of lands or pads. or exceed 0.13mm in diameter. Defect Class 1,2,3: Solder ball violates min electrical clearance. Solder balls not entrap

solder ball

Electronics Forum | Wed Jan 01 22:19:33 EST 2020 | sssamw

Solder ball attached on solder joint without violation minimum electrical clearance is acceptable. If your process parameter including stencil not changed, suggest you check if solder pasted being pushed out after IC placement, also check if solder j

solder ball

Electronics Forum | Tue Dec 31 02:04:19 EST 2019 | sssamw

From the picture, I cannot see clearly solder ball violate electrical clearance or cause a short, maybe it is. What I can see is the solder paste has some misalignment although it doesn't printed in solder mask area, but actual position will reduce

solder ball after reflow owen

Electronics Forum | Thu Aug 24 15:37:50 EDT 2006 | Chunks

Hi Any, This is from an earlies thread "Solder Ball After Reflow Process". Date: August 16, 2006 01:52 PM Author: Russ Subject: Solder Ball After Reflow Process Oven settings are meaningless here. What does the board see? It is the paste we a

solder balls

Electronics Forum | Mon Jul 16 15:49:33 EDT 2001 | Steve

The solder balls you are talking about are caused by too much paste. Reduce the size of the stencil aperatures. Concerning removing the solder balls, the first thing you need to ask yourself is, do I need to remove them. IPC-610, 12.4.10 states, "Ac


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