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Online AOI Machine

Online AOI Machine

Videos

ETA DIP Inverted Camera Online AOI Machine ETA-V5200 ​ If you could not find any similar items you want, you may send some photos to us. because our catalog and website haven't included all of our products. solder paste inspection,SMT SPI,SPI m

Dongguan Intercontinental Technology Co., Ltd.

SMTA International Exhibition 2015 - Electronics Manufacturing

SMTA International Exhibition 2015 - Electronics Manufacturing

Videos

SMTA International Electronics Exhibition Tuesday, September 29: 9am-5pm Wednesday, September 30: 9am-4pm Donald Stephens Convention Center Rosemont, IL See More Equipment & Technology Than Ever Before! Many of the 160 exhibiting companies will bri

Surface Mount Technology Association (SMTA)

auto pcb screen printer

auto pcb screen printer

New Equipment | Printing

ASCEN GS700 is a high accuracy auto pcb screen printer designed for high precision screen printing or SMT stencil printing in SMT industry. Features: Independent, direct driven motor scraper. Built-in accurate pressure control

ASCEN Technology

1200MM/1500MM Online SPI , Big Size Solder Paste Inspection Machine

1200MM/1500MM Online SPI , Big Size Solder Paste Inspection Machine

New Equipment | Test Equipment

1200MM/1500MM Online SPI , Big Size Solder Paste Inspection Machine mail: sales@smtlinemachine.com whatapp/wechat:+8613537875415 Specification: 技术参数/Parameters 技术平台/Technology Platform super big size platform 适用

CNSMT CO.LTD

Precision PCB Services, Inc. adds Side View Camera to their BGA Rework Stations

Industry News | 2018-07-16 17:50:00.0

Side View Camera now available with all BGA Rework Stations

Precision PCB Services, Inc

Surface Finish Issues Affecting Solderability and Reliability

Technical Library | 2019-06-07 14:49:54.0

ACI Technologies was contacted in regards to poor solder joint reliability. The customer submitted an assembly that was exhibiting intermittent opens at multiple locations on a ball grid array (BGA) component. The assembly’s functionality did not survive international shipping, essentially shock and vibration failures, immediately making the quality of the solder joints suspect. The customer was asked about the contract manufacturer and the reflow oven profile as well as the solder paste and surface finish used. The ACI engineering staff evaluated the contract manufacturer’s technique and determined that they were competent in the methods they used for placing thermocouples in the proper locations and developing the reflow oven profile. The surface finish was unusual, but not unheard of, in that it was hard gold over hard nickel, rather than electroless nickel immersion gold (ENIG). The customer was able to supply boundary scan testing data which showed a diagonal row of troublesome BGA pins.

ACI Technologies, Inc.

Stencil Cleaning Machine

Stencil Cleaning Machine

Videos

SMT Auto Aqueous Stencil Cleaning Machine If you could not find any similar items you want, you may send some photos to us. because our catalog and website haven't included all of our products. PCBA Cleaning Machine, On-line PCBA Cleaning Machi

Dongguan Intercontinental Technology Co., Ltd.

Ball Grid Array (BGA) Voiding Affecting Functionality

Technical Library | 2020-11-09 16:59:53.0

A customer contacted ACI Technologies regarding a high failure rate of their assemblies. They provided assemblies to be X-rayed and inspected for the purpose of identifying any process related issues such as (but not limited to) solder and assembly workmanship and evidence of damage due to moisture related problems during reflow (a.k.a. "popcorning"). Moisture damage usually appears as physical damage to the component. The first indication of moisture damage would be externally observable changes to the package in the form of bulging or fractures to the outer surface of the component, an example of which is shown in Figure 1. Internally observable indicators of moisture damage typically include fractures to the die inside the package and lifted or fractured wire bonds. These conditions would be apparent during transmissive X-ray inspection. Another symptom of moisture related damage would be inconsistent solder joint sizes that result from package deformation during the liquidus phase of the reflow process. None of these indicators of moisture related damage were present on the customer samples.

ACI Technologies, Inc.

I.C.T Lyra Series Reflow Oven with CBS Function

I.C.T Lyra Series Reflow Oven with CBS Function

Videos

Lyra Reflow Oven is a soft soldering that realizes the mechanical and electrical connection between the solder ends of surface mount components or the pins and the printed board pads by remelting the solder paste pre-distributed on the printed board

Dongguan Intercontinental Technology Co., Ltd.

BGA & Area Array Failures, Causes & Corrective Actions Online Webinar

Events Calendar | Mon Mar 16 00:00:00 EDT 2020 - Mon Mar 16 00:00:00 EDT 2020 | ,

BGA & Area Array Failures, Causes & Corrective Actions Online Webinar

Surface Mount Technology Association (SMTA)


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