Used SMT Equipment | AOI / Automated Optical Inspection
OMRON AOI VT-S720-A MACHINE Hardware Configuration Image signal input unit Main unit Power supply Air Camera Illumination Image resolution Feed method Line height PCB carrier width adjustment Ambient operating temperature Ambient opera
Used SMT Equipment | Pick and Place/Feeders
SAMSUNG CP63HP / CP63 High Speed Mounting Machine CP63HP Under IPC9850 conditions, the mount speed is 30,000 CPH The mount range is 0603(imperial 0201) ~ 24mm components, including BGA, QFP PCB large size Max. 500Mm * 400mm Additional 116 8mm fee
Amid the COVID 19 crisis, Precision PCB Sevices, Inc. remains open and cable to provide quick turn BGA Rework and Reballing Services with offices in Northern Californa and Dallas, Texas. Today are introducing our new Side View Camera for BGA Rework
http://www.pcb-separator.com/html/PRODUCTS/PCB%20separator/2015/0607/132.html PCB cutting machine/guillotine separator/PCB depaneling machine/PCB panel separator ASCEN specializing the SMT assmebly line equipment manufacture the more detail please ch
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Parts & Supplies | Pick and Place/Feeders
CM402 CM602 head filter filter cotton N210048234AA N610071334AA Other panasonic parts: 10467S0006AA REFLECTOR 10467S0052A CYLINDER 10467S0053AA CYLINDER 10483S0011AA NOZZLE HOLDER 1086213290 UNDER CAMERA UNIT 104687862604 LEVER 104687870006 N
Technical Library | 2020-11-09 16:59:53.0
A customer contacted ACI Technologies regarding a high failure rate of their assemblies. They provided assemblies to be X-rayed and inspected for the purpose of identifying any process related issues such as (but not limited to) solder and assembly workmanship and evidence of damage due to moisture related problems during reflow (a.k.a. "popcorning"). Moisture damage usually appears as physical damage to the component. The first indication of moisture damage would be externally observable changes to the package in the form of bulging or fractures to the outer surface of the component, an example of which is shown in Figure 1. Internally observable indicators of moisture damage typically include fractures to the die inside the package and lifted or fractured wire bonds. These conditions would be apparent during transmissive X-ray inspection. Another symptom of moisture related damage would be inconsistent solder joint sizes that result from package deformation during the liquidus phase of the reflow process. None of these indicators of moisture related damage were present on the customer samples.
New Equipment | Selective Soldering
To see more about the Jade MKII Single Point Selective Soldering System visit Pillarhouse USA at: https://www.pillarhouse.co.uk/products/selective-soldering-handload/jade-mkii-handload Entry-level, single point selective soldering system Designed t
New Equipment | Selective Soldering
Flexible, in-line, modular selective soldering system Designed as a modular system, the Synchrodex range of in-line equipment offers the ultimate in flexibility with the ability to upgrade to high speed throughput when multiple modules are placed to
New Equipment | Selective Soldering
99.998% required exhausting 500--800CMB/H carrier or PCB carrier according product max carrier size L400 x W400 mm PCB thickness 0.2mm-----6mm pcb edge 5mm or more controll
Training Courses | | | PCB Rework and Hand Soldering Courses
The PCB rework and hand soldering courses courses cover techniques of rework and repair of PCBs, BGAs and other electronics assemblies, and teach fundamentals of soldering of electronics assemblies.
