Industry Directory | Distributor / Manufacturer
Distribute solder supplies, bga inspection, bga re-balling, repair/rework equipment. Outfit assembly personel to perform all phases of manufacturing
Technical Library | 2019-08-07 22:56:45.0
The requirement to reconsider traditional soldering methods is becoming more relevant as the demand for bottom terminated components (QFN/BTC) increases. Thermal pads under said components are designed to enhance the thermal and electrical performance of the component and ultimately allow the component to run more efficiently. Additionally, low voiding is important in decreasing the current path of the circuit to maximize high speed and RF performances. The demand to develop smaller, more reliable, packages has seen voiding requirements decrease below 15 percent and in some instances, below 10 percent.Earlier work has demonstrated the use of micro-fluxed solder preforms as a mechanism to reduce voiding. The current work builds upon these results to focus on developing an engineered approach to void reduction in leadless components (QFN) through increasing understanding of how processing parameters and a use of custom designed micro-fluxed preforms interact. Leveraging the use of a micro-fluxed solder preform in conjunction with low voiding solder paste, stencil design, and application knowhow are critical factors in determining voiding in QFN packages. The study presented seeks to understand the vectors that can contribute to voiding such as PCB pad finish, reflow profile, reflow atmosphere, via configuration, and ultimately solder design.A collaboration between three companies consisting of solder materials supplier, a power semiconductor supplier, and an electronic assembly manufacturer worked together for an in-depth study into the effectiveness of solder preforms at reducing voiding under some of the most prevalent bottom terminated components packages. The effects of factors such as thermal pad size, finish on PCB, preform types, stencil design, reflow profile and atmosphere, have been evaluated using lead-free SAC305 low voiding solder paste and micro-fluxed preforms. Design and manufacturing rules developed from this work will be discussed.
Events Calendar | Mon Oct 07 00:00:00 EDT 2019 - Tue Oct 08 00:00:00 EDT 2019 | ,
PCBA Cleanliness End-of-Project Webinar
Industry Directory | Manufacturer
The exclusive supplier of SIPAD Solid Solder Deposit in North America and the only SIPAD Solid Solder Deposit (SSD) coating service bureau in the world.
Technical Library | 2007-12-13 17:03:02.0
Printer-hosted processes for solder ball placement are now widely used for package technologies ranging from BGAs using ball diameters above 750μm to the latest WL-CSPs demanding 250μm diameter. This broadening spectrum of applications brings more choices in terms of stencil design rules and production methodologies.
Used SMT Equipment | Soldering Equipment/Fluxes
The Opus 3 is a four-axis Cartesian Robot designed specifically for selectively soldering through-hole and odd-form components into surface-mount and mixed-technology printed circuit boards from the bottom side without inverting the PCB. The Opus 3 w
Industry Directory | Distributor / Manufacturer / Manufacturer's Representative
European supplier of Lead Free solder products like the paste compositions SnZnAl (low melting point), SAC, SnBi, flux, BGA Balls, solder wire, N2 Reflow Systems.
Industry Directory | Consultant / Service Provider / Manufacturer / Other
Global provider of Legacy PCB Re-Engineering Systems & Process Control Tools since 1990.
Industry Directory | Manufacturer
Alltemated sets the standard for tape and reel packaging, IC programming, lead trim/forming, bake and dry-pack services and carrier tape manufacturing.
Stencils, metal mask tools used for the deposit of solder paste or preformed solder balls onto BGA substrate. Please call for the best process for your requirements.
