Low Velocity Nitrogen Convection for BGA Solder Ball Attachment and Semiconductor Backend Assembly
We are a Re-balling company based in Chihuahua, Chihuahua.Our core business is the Salvage and Recovery of Electronic Components.Also we offer technical consulting and training in SMT and Wave Soldering.
Industry News | 2017-01-17 15:39:40.0
STI Electronics today announced that it has been selected to receive the “Best of Conference” award for a paper presented during SMTA International in September. The paper entitled “BTC/QFN Test Board Design Considerations and Method for Qualifying Soldering Materials and Cleaning Processes” was co-authored by Dr. Mike Bixenman of KYZEN, and Mark McMeen and Jason Tynes from STI Electronics.
Used SMT Equipment | AOI / Automated Optical Inspection
2011 MIRTEC MV-3L PCB AOI MACHINE IS IN GOOD WORKING CONDITION AND CAN BE DEMO'D IN PERSON OR VIRTUALLY! SN: 13110930-0839 DOM: 30 SEP 2011 2D Inspection Power: 85-264V / 4.4A / 50-60 Hz INSPECTION AREA: 450 x 400 mm INSPECTION ITEMS:&n
Used SMT Equipment | AOI / Automated Optical Inspection
Mirtec MV-3L PCB AOI MACHINE IS IN GOOD WORKING CONDITION AND CAN BE DEMO'D IN PERSON OR VIRTUALLY! SN: 13100524-0524 DOM: 24 MAY 20102D InspectionPower: 85-264V / 4.4A / 50-60 HzINSPECTION AREA: 450 x 400 mmINSPECTION ITEMS: Lifted Lead, Lifted Comp
Used SMT Equipment | AOI / Automated Optical Inspection
2015 MIRTEC MV-3U LARGE PCB AOI MACHINE IS IN GOOD WORKING CONDITION AND CAN BE DEMO'D IN PERSON OR VIRTUALLY! SN: 13150216-1452 DOM: 16 FEB 20152D Inspection5 Camera Inspection SystemPower: 85-264V / 4.4A / 50-60 HzINSPECTION AREA: 660mm x 510 mmIN
Industry News | 2016-09-11 12:17:53.0
KYZEN is pleased to announce that Dr. Mike Bixenman will present the recent paper “BTC/QFN Test Board Design Considerations and Method for Qualifying Soldering Materials and Cleaning Processes” at SMTA International. The paper is co-authored by Mark McMeen and Jason Tynes from STI Electronics, and will be presented during the Manufacturing Excellence Track during Session MFX7 - Cleaning: New Techniques, on Thursday, September 29, 2016 at 9 a.m.
Industry News | 2017-01-17 16:35:22.0
KYZEN is pleased to announce that one of Dr. Mike Bixenman’s papers that was presented during SMTA International 2016 has been selected by the SMTA for a Best Paper Award. Dr. Bixenman won the Rich Freiberger Best of Conference Award for his presentation entitled “BTC/QFN Test Board Design Considerations and Method for Qualifying Soldering Materials and Cleaning Processes.” Bixenman co-authored the paper with Mark McMeen and Jason Tynes from STI Electronics.
Salvage indispensible Ball Grid Arrays. Artek Manufacturing will: *Clean and Bake out all contaminants and moisture *Clean out all exsisting Solder *Replace solder spheres according to manufacture's specs *Bake out BGA prior to packing in MSD package
Industry Directory | Equipment Dealer / Broker / Auctions
CMTec is highly specialized in dealing with assembly equipment. We support BESI (ESEC, Datacon), Kulicke & Soffa, Hesse & Knipps, F&K Delvotec, Orthodyne, ASM, Dage and others. CMTec delivers 'turn-key' projects worldwide.
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