New Equipment | Rework & Repair Equipment
Cost Effective Rework of Medium Size Boards The FINEPLACER® coreplus is a compact, yet versatile rework system that offers a level of professionalism that exceeds its attractive price. The system offers proven rework technology for a wide spectrum
New Equipment | Cleaning Equipment
Precision Fine Pitch Aperture Cleaners Thousands of dollars less than fully-automatic cleaners Low solvent usage and running costs Fast cleaning time of 1-3 minutes Minimal waste disposal Portable unit can be used directly on the screen printe
Industry News | 2019-03-05 17:59:34.0
SHENMAO America, Inc. is pleased to announce that it will exhibit at electronica China, scheduled to take place March 20-22, 2019 at the Shanghai New International Expo Centre. The company will showcase its PQ10 series low temperature solder paste, new P250 series solder paste for automobile electronics, PW215 water soluble solder paste, SMF-WC53 water soluble ball-attach flux and solder sphere, and water-based wave soldering flux & water-based cleaner.
Technical Library | 2015-02-19 16:54:34.0
Pad cratering is an important failure mode besides crack of solder joint as it’ll pass the regular test but have impact on the long term reliability of the product. A new pin pull test method with solder ball attached and positioning the test board at an angle of 30º is employed to study the strength of pad cratering. This new method clearly reveals the failure mechanism. And a proper way to interpret the finite element analysis (FEA) result is discussed. Impact of pad dimension, width and angle of copper trace on the strength is included. Some findings not included in previous research could help to guide the design for better performance
Industry News | 2015-12-14 22:14:22.0
SHENMAO PF606-P133 Solder Paste is designed for selective laser soldering on tiny solder joints (1.5mm or smaller), especially on expensive, temperature-sensitive components and assemblies. In the past, such a small solder joint is not suitable for standard reflow processes and has to be soldered manually. With PF606-P133 Solder Paste, automatic laser soldering can easily be accomplished.
Industry News | 2015-12-16 18:10:21.0
SHENMAO PF606-P133 Solder Paste is designed for selective laser soldering on tiny solder joints (1.5mm or smaller), especially on expensive, temperature–sensitive components and assemblies. In the past, such a small solder joint is not suitable for standard reflow processes and has to be soldered manually. With PF606-P133 Solder Paste, automatic laser soldering can easily be accomplished.
Swiftmode's Hyperclean Under Stencil SMT Wiper Rolls are the only product in the market that has beed developed specifically for the application. Best vacuum performance, less IPA usage and No loose fibres making the solder paste printing process mor
Industry News | 2014-11-18 18:10:25.0
Nordson DAGE, a division of Nordson Corporation (NASDAQ: NDSN) have adopted the company’s hot pin pull test method for checking the integrity of solder ball attach on packages and PCBs in accordance with the industry standard IPC9708. This particular standard provides guidelines for bond testing to identify potential pad craters.
New Equipment | Cleaning Agents
Broad Spectrum Electronics Cleaning Solvent IONOX® I3302 is a semi-aqueous solvent blend designed to remove difficult flux and paste residues including lead-free, rosin, no-clean, and tacky flux, as well as other common electronic assembly residues.
