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Metcal to Display the Scarab Site Cleaning System at NEPCON South China

Industry News | 2015-07-21 08:12:52.0

Metcal today announced plans to exhibit in Booth B-1G26 at NEPCON South China, scheduled to take place Aug. 25-27, 2015 at the Shenzhen Convention & Exhibition Center. The new Metcal Scarab Site Cleaning System (APR-2000-SCS) will be on display, along with the new Solder Ball Replacement Kit and MX-HPDC dual cartridge hand-piece.

Metcal

ePaste Lead-Free Solder Paste

ePaste Lead-Free Solder Paste

New Equipment | Solder Materials

With its tin-copper-nickel-germanium alloy, SN100C is a popular lead-free wave soldering alloy. Although initially developed to address the need for an economical wave solder, it has since been found that its properties make SN100C ideal for reflow a

Nihon Superior Co., Ltd.

SMT Stencil Printers for PCB Assembly

SMT Stencil Printers for PCB Assembly

Videos

http://www.ddmnovastar.com/stencil-printers - DDM Novastar Stencil Printers are designed for short to medium run PCB assembly. Ranging from manual to semi-automatic, these durable, easy-to-use systems provide repeatable, reliable results. Greatly r

DDM Novastar Inc

A brief demonstration showing the 2014 YESTech FX operating

A brief demonstration showing the 2014 YESTech FX operating

Videos

This is a brief demonstration showing the 2014 YESTech FX operating. This machine is available at the Capital Equipment Exchange. www.ce-exchange.com

Capital Equipment Exchange

More BGA Defect Examples Available Royalty FREE

Industry News | 2017-01-05 04:27:37.0

BGA Inspection & Defect Photo Album (Can be downloaded) The photo CD-ROM album featuring over 280 colour images on BGA, materials, inspection and defects and is available to allow engineers to create their own training material, PowerPoint files, process documents, technical articles and standards. The disk includes examples of the following:

ASKbobwillis.com

Retronix Installs Hentec/RPS Lead Tinning Machine in Scotland Facility

Industry News | 2021-05-04 13:53:27.0

Odyssey 1750 provides high reliability BGA alloy exchange and component re-finishing capabilities.

Hentec Industries, Inc. (RPS Automation)

Ball Grid Array (BGA) assembly

Industry News | 2018-10-18 09:04:01.0

Ball Grid Array (BGA) assembly

Flason Electronic Co.,limited

SHENMAO Presents Technical Paper at SMTA/ICSR Conference

Industry News | 2016-04-21 00:17:09.0

SHENMAO Technology will present the technical paper "A New Dispensing Solder Paste for Laser Soldering Technology" at the 10th. Anniversary of the SMTA International Conference of Soldering and Reliability 2016 in Toronto, Canada, featuring advancements in newly developed composition of Powder, Fluxes and produces best dispensability, minimal flux residue, no-splash or solder balling issues and minimal and smaller voids.

Shenmao Technology Inc.

SHENMAO Exhibits at ECTC in Las Vegas June 1-2, 2016 Booth # 505 Introduces PF606-P116 / PF606-P128 / PF606-XP LED Die Bonding Solder Pastes

Industry News | 2016-06-05 13:20:49.0

SHENMAO PF606-P116 Halogen Free Water Soluble LED Die Bonding Solder Pastes are made locally in the USA and with the same quality in 8 other worldwide locations.

Shenmao Technology Inc.

Thermaltronics Launches New Solder Robot to Simplify Soldering Applications

Industry News | 2020-05-12 11:44:16.0

Thermaltronics USA, Inc. announces that it has added a new product to its solder robot range: the TMT-R8000S. The system simplifies and automates hand soldering processes with precision ball screws, servo motors and industry-leading software.

Thermaltronics USA, Inc.


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