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IONOX® I3302 Broad Spectrum Electronics Cleaner

IONOX® I3302 Broad Spectrum Electronics Cleaner

New Equipment | Cleaning Agents

Broad Spectrum Electronics Cleaning Solvent IONOX® I3302 is a semi-aqueous solvent blend designed to remove difficult flux and paste residues including lead-free, rosin, no-clean, and tacky flux, as well as other common electronic assembly residues.

KYZEN Corporation

What are the Major Causes of Variable Frequency Drive (VFD) Damage?

Industry News | 2021-12-07 20:24:41.0

Variable frequency drive belongs to electronic products, which were composed of many components. An electronic product will not correctly work if any component goes wrong. The Common failures of frequency converters are overvoltage, overload, overcurrent and overheating. They are generally caused by improper use and the operating environment. Meanwhile, there's a particular service life for electronic products. The aging of the product will be more evident as the use of time increases.

OKmarts Industrial Parts Mall

SEHO at Productronica 2013: A PLUS of Innovations and a PLUS of Services

Industry News | 2013-10-09 08:35:53.0

SEHO Systems GmbH will exhibit in Hall A4, Stand #578 at the Productronica International Trade Fair in Munich, Germany.

SEHO Systems GmbH

ViTrox Technologies' V810 Selected as Finalist for 2012 Best in Test Awards

Industry News | 2011-11-03 21:29:45.0

ViTrox Technologies announces that its V810 Automated 3-D In-Line X-ray Inspection System has been selected as a finalist for the 2012 Best in Test Awards.

ViTrox Technologies

DEK and PacTech Join Forces for High-Volume Wafer Bumping Solution

Industry News | 2003-06-13 10:10:58.0

By combining PacTech's electroless under bump metallization (UBM) processing with DEK's advanced mass imaging systems to create the solder bumps, users can implement a wafer-level, SMT-compatible flip chip assembly process.

ASM Assembly Systems (DEK)

Introduction to Machine Vision Part 1, Definition & Applications

Introduction to Machine Vision Part 1, Definition & Applications

Videos

This is the first in a series of 10-minute videos to introduce new users to the basics of machine vision technology. In this video, users will learn what machine vision is, how it is used in factory automation, and its four most common applications.

Microscan

Analysis of Laminate Material Properties for Correlation to Pad Cratering

Technical Library | 2016-10-20 18:13:34.0

Pad cratering failure has emerged due to the transition from traditional SnPb to SnAgCu alloys in soldering of printed circuit assemblies. Pb-free-compatible laminate materials in the printed circuit board tend to fracture under ball grid array pads when subjected to high strain mechanical loads. In this study, two Pb-free-compatible laminates were tested, plus one dicycure non-Pb-free-compatible as control. One set of these samples were as-received and another was subjected to five reflows. It is assumed that mechanical properties of different materials have an influence on the susceptibility of laminates to fracture. However, the pad cratering phenomenon occurs at the layer of resin between the exterior copper and the first glass in the weave. Bulk mechanical properties have not been a good indicator of pad crater susceptibility. In this study, mechanical characterization of hardness and Young’s modulus was carried out in the critical area where pad cratering occurs using nano-indentation at the surface and in a cross-section. The measurements show higher modulus and hardness in the Pb-free compatible laminates than in the dicy-cured laminate. Few changes are seen after reflow – which is known to have an effect -- indicating that these properties do not provide a complete prediction. Measurements of the copper pad showed significant material property changes after reflow.

CALCE Center for Advanced Life Cycle Engineering

Senior Engineering Microassembler

Career Center | Brooklyn, New York USA | Engineering,Production

Mini-Circuits designs, manufactures and distributes integrated circuits, modules, and sub-systems for high performance radio frequency (RF) and microwave applications.  With design, sales and manufacturing locations in over 30 countries, Mini-Ci

Mini-Circuits

FINEPLACER® core<sup>plus</sup> - Medium Size BGA Rework Station

FINEPLACER® coreplus - Medium Size BGA Rework Station

New Equipment | Rework & Repair Equipment

Cost Effective Rework of Medium Size Boards The FINEPLACER® coreplus is a compact, yet versatile rework system that offers a level of professionalism that exceeds its attractive price.  The system offers proven rework technology for a wide spectrum

Finetech


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