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Flason SMT Second hand Automatic1200mm Solder paste printer for SMT assembly line

Flason SMT Second hand Automatic1200mm Solder paste printer for SMT assembly line

New Equipment | Printing

Flason SMT Second hand Automatic1200mm Solder paste printer for SMT assembly line Power Supply: AC:220±10%,50/60HZ Control Method: PC Control PCB Size/Max:1200*340mm Weight Approx:1500Kg Product description: Second hand Automatic1200mm

Flason Electronic Co.,limited

Flason SMT China second hand Automatic Solder paste printer good quality

Flason SMT China second hand Automatic Solder paste printer good quality

New Equipment | Printing

Flason SMT China second hand Automatic Solder paste printer good quality Power Supply: AC:220±10%,50/60HZ Control Method: PC Control PCB Size/Max: 850*500mm Weight Approx:1300Kg Product description: China second hand Automatic Solder p

Flason Electronic Co.,limited

Microstructure and Intermetallic Formation in SnAgCu BGA Components Attached With SnPb Solder Under Isothermal Aging

Technical Library | 2022-10-31 17:09:04.0

The global transition to lead-free (Pb-free) electronics has led component and equipment manufacturers to transform their tin–lead (SnPb) processes to Pb-free. At the same time, Pb-free legislation has granted exemptions for some products whose applications require high long-term reliability. However, due to a reduction in the availability of SnPb components, compatibility concerns can arise if Pb-free components have to be utilized in a SnPb assembly. This compatibility situation of attaching a Pb-free component in a SnPb assembly is generally termed "backward compatibility." This paper presents the results of microstructural analysis of mixed solder joints which are formed by attaching Pb-free solder balls (SnAgCu) of a ball-grid-array component using SnPb paste. The experiment evaluates the Pb phase coarsening in bulk solder microstructure and the study of intermetallic compounds formed at the interface between the solder and the copper pad.

CALCE Center for Advanced Life Cycle Engineering

Flason SMT Automatic 1200mm Solder paste printer for SMT assembly line

Flason SMT Automatic 1200mm Solder paste printer for SMT assembly line

New Equipment | Printing

Flason SMT Automatic 1200mm Solder paste printer for SMT assembly line Power Supply: AC:220±10%,50/60HZ Control Method: PC Control PCB Size/Max:1200*340mm Weight Approx:1500Kg Product description: Automatic1200mm Solder paste printer f

Flason Electronic Co.,limited

China second hand Automatic Solder paste printer good quality

China second hand Automatic Solder paste printer good quality

New Equipment | Soldering - Other

SMT Stencil Printer China second hand Automatic Solder paste printer good quality Power Supply: AC:220±10%,50/60HZ Control Method: PC Control PCB Size/Max: 850*500mm Weight Approx:1300Kg Product description: China second han

Flason Electronic Co.,limited

Flason SMT Automatic 1200mm Solder paste printer for SMT assembly line

Flason SMT Automatic 1200mm Solder paste printer for SMT assembly line

New Equipment | Printing

SMT Assembly line Power Supply: AC:220±10%,50/60HZ Control Method: PC Control PCB Size/Max:1200*340mm Weight Approx:1500Kg Product description: Automatic1200mm Solder paste printer for SMT assembly line-Good Price! Good Quality! Good

Flason Electronic Co.,limited

CYBERSOLV® C8882 - Understencil Wipe / Stencil Cleaning

CYBERSOLV® C8882 - Understencil Wipe / Stencil Cleaning

New Equipment | Cleaning Agents

CYBERSOLV® C8882 is a fast-acting stencil cleaning solvent designed for the understencil wipe process. CYBERSOLV® C8882 instantly dissolves all flux types within the solder paste, including water soluble, rosin and low residue no-clean fluxes. CYBERS

KYZEN Corporation

Flason SMT Automatic 1200mm Solder paste printer for SMT assembly line

Flason SMT Automatic 1200mm Solder paste printer for SMT assembly line

New Equipment | Soldering - Other

SMT Stencil Printer Automatic 1200mm Solder paste printer for SMT assembly line Power Supply: AC:220±10%,50/60HZ Control Method: PC Control PCB Size/Max:1200*340mm Weight Approx:1500Kg Product description: Automatic1200mm So

Flason Electronic Co.,limited

Indium Corporation Features Indium3.2HF Pb-Free Water-Soluble Solder Paste at Productronica China

Industry News | 2016-02-18 00:22:10.0

Indium Corporation will feature Indium3.2HF water-soluble solder paste at Productronica China on March 15-17, 2016, at the Shanghai New International Expo Centre in Shanghai, China.

Indium Corporation


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