Industry Directory | Manufacturer
Industrial distributor- supplier based in Santa Rosa City, Laguna Philippines. Its products are: - Soldering Stations, Replacement Soldering tips, Soldering Pots (solder bath), Soldering Thermometer, Soldering Tools & accessories, Anti-Static Tools, Anti-Static Ionizers, ESD products likes esd brush, esd tweezers, esd rubber mat, anti-static wrist strap. It is also a supplier of Digital Body
Industry Directory | Distributor / Equipment Dealer / Broker / Auctions / Manufacturer
Our company is a global supplier of ready solutions for each process of electronics productions.We supply SMT equipment, PCB cleaning equipment and full range of materials. We make also qualified customer support and spare parts.
New Equipment | Selective Soldering
http://www.flason-smt.com/product/Selective-Soldering-Machine-ERSA-VERSAFLOW-3-45.html Selective Soldering Machine ERSA VERSAFLOW 3/45 Selective Soldering Machine ERSA VERSAFLOW 3/45 Selective Soldering Machine Selective Soldering System ERSA
New Equipment | Selective Soldering
Flason SMT Selective Soldering Machine ERSA VERSAFLOW 3/45 Selective Soldering Machine ERSA VERSAFLOW 3/45 Selective Soldering Machine Selective Soldering System ERSA VERSAFLOW 3/45 Product description: Selective Soldering Machine ERSA VERSAFL
Used SMT Equipment | Soldering - Wave
400V 50/60 HZ Version ERSAsoft for: 4.050.000.000 2. Operating System Dell / Windows 7 Processor: Pentium(R) Dual Core E5800 @ 3.20GHz 3.19GHz Memory RAM: 4.00 GB (3.46 GB usable) 320bit Operating System Touch Screen – No Pen Touch, input is availabl
Used SMT Equipment | Soldering - Selective
Options: • Less than 100 hours of operation • Top side pre-heat • DC servo drives • Integral PC and machine mounted TFT monitor • Inerted Nitrogen system • Auto motorized wire solder feed & level detect • Solder bath coding – ide
Industry News | 2003-06-23 08:49:39.0
Three Organizations from the US, Europe and Japan to
Industry News | 2018-10-18 09:46:58.0
Analysis of how to spot welding process
Technical Library | 2014-03-06 19:04:07.0
Over the last few years, there has been an increase in the rate of Head-in-Pillow component soldering defects which interrupts the merger of the BGA/CSP component solder spheres with the molten solder paste during reflow. The issue has occurred across a broad segment of industries including consumer, telecom and military. There are many reasons for this issue such as warpage issues of the component or board, ball co-planarity issues for BGA/CSP components and non-wetting of the component based on contamination or excessive oxidation of the component coating. The issue has been found to occur not only on lead-free soldered assemblies where the increased soldering temperatures may give rise to increase component/board warpage but also on tin-lead soldered assemblies.
Technical Library | 2010-04-29 21:40:37.0
The purpose of this paper is to investigate the effects of reflow time, reflow peak temperature, thermal shock and thermal aging on the intermetallic compound (IMC) thickness for Sn3.0Ag0.5Cu (SAC305) soldered joints.
Ultra-flexible, offline, multi-platform selective soldering system Designed to meet the needs of the small batch manufacturer who requires high levels of production flexibility. The Jade Pro offers the ability to regularly change solder alloys witho
Ultra-flexible, offline, multi-platform, quick load twin PCB rotary table selective soldering system Designed to meet the needs of the small batch manufacturer who requires high levels of production flexibility. The Jade Prodex offers the ability to
Training Courses | ONLINE | | PCB Assembly Courses
The PCB assembly courses provide knowledge of different processes and equipment used in TH and SMT assembly of printed circuit boards.
Career Center | HOUSTON, Texas USA | Production,Technical Support
TUAN ANH LY 4545 Cook Rd # 601 Houston, TX 77072 (Cell) : (713) 732 - 1315 (E-Mail): tuanly64@yahoo.com _____________________________________________________________________
Effects of reflow profile and thermal conditioning on intermetallic compound thickness for SnAgCu soldered joints. Effects of reflow profile and thermal conditioning on intermetallic compound thickness for SnAgCu soldered joints. The purpose
GPD Global | https://www.gpd-global.com/co_website/news-events-pr-531.php
& Fill / Glob Top Encapsulation Hot Melt LED Encapsulation Solder Mask Solder Paste Surface Mount Adhesive Thermal Interface Material Trench Filling Underfill UV Curing Wafer Processing OTHER
Surface Mount Technology Association (SMTA) | https://www.smta.org/hutchins/hutchins.cfm
: "Assessments of Solder Joint Interconnection and Inner Package Interconnection (Via) Qualities for Improved Understanding of Chip to Package Interaction, Using Laser Ultrasonic Inspection Technique" Where is he now
