Electronics Forum | Thu Aug 05 10:12:18 EDT 1999 | John Thorup
| Hello Netters, | | Can anyone provide me with info or where to get info on acceptability of solder beads and solder balls? | | Thanks for any help | | Tom B. | Hi Tom Wolfgang is right. We think you should correct your process to reduce ball f
Electronics Forum | Fri Apr 22 15:59:42 EDT 2005 | Valerie
Besides poor printing using cold solder paste will also cause solder beading.
Electronics Forum | Sun Jun 07 09:38:42 EDT 1998 | Bob Willis
If you mean solder beads at the side of chip components then download the FAQs and the process guide on solder beads which may be of interest. The documents are on my web site www.bobwillis.co.uk | We are getting solder balls after reflow of surface
Electronics Forum | Fri Apr 03 14:37:44 EDT 2009 | rkevin
What you have described are actually called Solder Beads for clarification. Solder beads and solder balls though closely related, are quite different. For a good read on how to eliminate them before they form check out this article : http://smt.penn
Electronics Forum | Thu Aug 23 11:07:58 EDT 2001 | Hussman
Yup - this is what the homeplate design does.
Electronics Forum | Tue Apr 05 10:39:20 EDT 2011 | tkirk
Thanks! That definitely seemed to help. TK
Electronics Forum | Thu Mar 11 12:45:40 EST 2004 | Daniele
Hi I have a question about proper installing thermocopule to PCB. I have thermocouple which consist of two wires and they are conected at the end by solder bead. I would like to use adhesive tape to connetct it to the PCB. Should i remove solder bea
Electronics Forum | Thu Dec 16 06:59:43 EST 1999 | Christopher Lampron
Calvin, We have found several reasons for solder beading occurance. We have found that solder balling is usually directly attributed to the reflow profile while solder beading is usually (but not always) a result of either excessive solder paste volu
Electronics Forum | Thu Aug 05 04:51:46 EDT 1999 | Wolfgang Busko
| | Hello Netters, | | | | Can anyone provide me with info or where to get info on acceptability of solder beads and solder balls? | | | | Thanks for any help | | | | Tom B. | | | | Tom, | The IPC sets the standards for acceptability. But in a nu
Electronics Forum | Wed Aug 22 17:29:29 EDT 2001 | Michael
We've found beading is not neccesarily the amount of paste but where it's applied. Trapping paste under components seems to be the culprit. On components where we couldn't reduce aperature size we simply moved it outward actually overprinting the p
