Events Calendar | Mon Feb 11 00:00:00 EST 2019 - Mon Feb 11 00:00:00 EST 2019 | ,
Webinar: Solder Paste Evaluation & Simple Tricks of the Trade
Events Calendar | Tue Feb 12 00:00:00 EST 2019 - Tue Feb 12 00:00:00 EST 2019 | ,
Webinar: BGA and Area Array Process Defects - Causes & Cures
Training Courses | | | Other Courses
Other courses related to electronics manufacturing and assembly
Industry News | 2018-10-18 09:27:40.0
Time Temperature setting wave soldering is the most important in the solder melts
Used SMT Equipment | Screen Printers
SP700 that has been fully tested, all maintenance performed and guarnateed 100%production ready. Features: Automatic Rail Width Adjust Fully Automatic Stencil Load & Eject Fully Programamble Wet/Dry Vacuum Under Stencil Cleaner On-ste
Industry News | 2017-02-05 09:21:06.0
Solder balls and solder beading have been a process issue for many years and they may not cause product failure or quality problems but they are not desirable. Solder balls are caused by a variety of factors in different processes and should be resolved to eliminate a poorly defined process or a process and materials which are out of control With over 40 years in industry and 30 solving process problems for industry Bob Willis explains the causes and curses for solder balls. Bob’s webinar features many unique process video clips on testing and failures and make his sessions come alive providing a much better understanding of the root cause of failure and corrective action. For further details go to http://www.bobwillis.co.uk/event/solder-ball-elimination-in-wave-selective-reflow/
Industry News | 2017-12-19 19:54:07.0
Indium Corporation will feature Indium11.8HF-SPR Solder Paste – a new air and nitrogen reflow, no-clean, Pb-free solder paste designed to meet the fine feature printing requirements of mobile manufacturers – at IPC APEX Expo 2018, Feb. 24-March 1 in San Diego, Calif.
Industry News | 2018-10-18 09:02:41.0
How to Solder a Surface Mount Device to a PCB Pad
Industry News | 2020-05-18 13:32:28.0
Transition Automation, Inc. today introduces a revised hand squeegee stand that improves the handling of solder paste for mission-critical R&D and Hand Solder Paste Printing environments. The stand serves to nest the squeegee at a specific angle to keep the solder paste bead stable on the blade during idle time between printing.The open regions around the stand provide easy access for operators to insert the squeegee into the holder. The holder also features scratch-proof nesting to keep the squeegee snug and in place if it is bumped or jostled.
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Distributor of electronic components and electromechanical devices
