Electronics Forum | Wed Nov 29 17:00:40 EST 2006 | John S.
We've used both effectively to resolve this issue. Check with your stencil manufacturer. Often, they can give you a very good starting place on issues like this since they see everyone's designs. John S.
Electronics Forum | Wed Nov 29 17:05:15 EST 2006 | slthomas
I have used a 10% area reduction with home plates on 6 mil stencils with good success. If you're using 5 mil stencils you might go with 0 or 5% reduction.
Electronics Forum | Wed Nov 29 22:48:42 EST 2006 | davef
Look here: http://www.smtnet.com/Forums/Index.cfm?CFApp=1&Message_ID=45733
Electronics Forum | Fri Dec 15 00:11:12 EST 2006 | pnguyvu
Contact Steve Yen @714-636-6211 or incoming@usastencils.com He'll be happy to help to with that. Good luck !
Electronics Forum | Wed Dec 06 16:48:42 EST 2006 | Mario Scalzo
I would be glad to help you eliminate the solder balling and beading that you are seeing. As this is a fairly common defect, I would like to forward you an Application Note that we have developed that explains the cause and possible solutions. Most
Electronics Forum | Fri Jul 06 18:17:34 EDT 2001 | davef
We find no solder balls after washing our boards. It works GREAT!!! ;-) Probably more to the point, look at "Circuits Assembly" 7/01, p 40, "Eliminating Solder Beads In No-Clean PCBs". "Solder mask type & composition are the greatest contributor t
Electronics Forum | Thu Feb 08 12:02:15 EST 2001 | slthomas
After reading the variety of responses, I feel moved to ask if you're you talking about what are occasionally referred to as solder beads (mid-chip solder balls, attached to the waste line of your chip caps and resistors) or the solder balls that ten
Electronics Forum | Mon Jul 16 14:48:16 EDT 2001 | mparker
Just received "Circuits Assembly", July 2001 issue. An article regarding solder balls and aperture design, beginning on page 40. This DOE had aperture, reflow profile and no clean pastes (3 types) as attributes. It is advocated that a U-shaped a
Electronics Forum | Thu Jul 19 08:00:03 EDT 2001 | doctord
Solder balls or mid chip beads? Remember IPC classification for Class 2 allows mid chip beads encapsulated in flux. Usually on R's and C's first thing I would do is verify .006 laser stencil 10% reduction and the most critical, The paste must be on t
Electronics Forum | Thu Sep 20 17:24:29 EDT 2001 | steveb
Have you seen any solder beading (balling) with the aperture sizes you have been using on 0201 components? Have you experimented with some of the solder bead reducing designs?
