SMT and PCB Packaging, Semiconductor Packaging, LED Packaging, Electromechanical Assembly, Flat Panel Assembly, etc. Features and Benefits Convenience – With non-contact injection technology, the need to move the z-axis up and down is eliminated.
Increased Dispense Area over SD6 Series for Underfill, Glob Top, Dam & Fill, LED Packaging, Surface Mount Adhesive Dispensing, etc. Features and Benefits Convenience – With non-contact injection technology, the need to move the z-axis up and down
System Design • Functional specifications • Hardware/Software architecture identification • Preliminary cost estimates Engineering Design and Management
Industry Directory | Manufacturer
Nepes offers flip chip solutions ranging from wafer bumping to advanced packaging and testing for IC manufactures, module electronics and end-product makers.
Industry News | 2022-09-15 06:27:38.0
The Assembly Division of MacDermid Alpha Electronics Solutions, a world leader in the production of electronics soldering and bonding materials, will present the technical paper: "Edge Bonding as Viable Reinforcement For Solder Joints in High Reliability Applications" at the SMTA Penang Chapter Expo & Technical Forum 2022 taking place from September 21 - 22 in Penang, Malaysia.
Industry Directory | Manufacturer
Micralyne offers a patented process for electroplating AuSn solder alloy, at compositions from 10 to 40 Sn (wt%), in patterned or unpatterned shapes onto metallized substrates at virtually any thickness.
Industry Directory | Manufacturer
PCB Assembly in Indonesia with ISO Certificate Are you looking for SMT and PCB Assembly ? We provide SMT and PCB Assembly service in Indonesia. Located at bonded zone West Java Indonesia. Suitable for export oriented market.
As the first commercially available adhesive to address the emerging surface-mount market in the 1980s, Loctite Chip bonder and Eccobond products today are the industry standard for mixed-technology and double-sided surface mount technology (SMT) app
Training Courses | | | IPC-7711/7721 Specialist (CIS)
The Certified IPC-7711/7721 Specialist (CIS) training focuses on rework of electronic assemblies and repair and modification of printed boards and electronic assemblies.
Technical Library | 2018-04-05 10:40:43.0
The miniaturization of microchips is always driving force for revolution and innovation in the electronic industry. When the pitch of bumps is getting smaller and smaller the ball size has to be gradually reduced. However, the reliability of smaller ball size is getting weaker and weaker, so some traditional methods such as capillary underfilling, corner bonding and edge bonding process have been being implemented in board level assembly process to enhance drop and thermal cycling performance. These traditional processes have been increasingly considered to be bottleneck for further miniaturization because the completion of these processes demands more space. So the interest of eliminating these processes has been increased. To meet this demand, YINCAE has developed solder joint encapsulant adhesives for ball bumping applications to enhance solder joint strength resulting in improving drop and thermal cycling performance to eliminate underfilling, edge bonding or corner bonding process in the board level assembly process. In this paper we will discuss the ball bumping process, the reliability such as strength of solder joints, drop test performance and thermal cycling performance.
