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Aluminum Bonding

Aluminum Bonding

New Equipment | Materials

Alternative to Brazing S-Bond can be an alternative lower temperature joining process and replace brazing in some applications. S-Bond is very effective in soldering aluminum to aluminum as well as soldering aluminum to copper.

S-Bond Technologies

C-Quence - Automated in-line Bonding and Soldering Solutions

C-Quence - Automated in-line Bonding and Soldering Solutions

New Equipment | Soldering Robots

With the C-Quence™ Nordson DIMA offers innovative automated and integrated in-line solutions for Hot Bar Reflow Soldering, Heat Seal Bonding, ACF Laminating and/or Heat Staking applications.  With Nordson DIMA's automated and integrated C-Quence™

C-Tech Systems, B.V. [formerly Nordson DIMA]

Kapp Copper-Bond Flux - High Temperature Soldering Flux

Kapp Copper-Bond Flux - High Temperature Soldering Flux

New Equipment | Solder Materials

Kapp Copper-Bond Flux™ has been designed for high temperature soldering of all common metals except Aluminum. Kapp Copper-Bond Flux™ is an activated liquid flux containing a mixture of inorganic salts in water, with approximately 50% active ingredien

Kapp Alloy & Wire, Inc

EWI SonicSolder

EWI SonicSolder

New Equipment | Assembly Services

S-Bond has been licensed as a supplier and provider of ultrasonic activated joining services using EWI SonicSolder®, an EWI patented* binary lead-free solder alloy that melts at 231°C. In conjunction with ultrasonic soldering, it can be used to join

S-Bond Technologies

SJB Capillary

SJB Capillary

New Equipment | Other

For Solder Jet Bonding – SJB / Flip-Chip

K-Net International Ltd.,Part

C-Base - Bonding and Soldering Desktop System

C-Base - Bonding and Soldering Desktop System

New Equipment | Soldering Robots

The C-Base Bonding/Soldering system is a combination of a C-Flow and a C-Drive module and stands alone from other pulsed heat controllers with its unique integration of responsive temperature control and useful tools such as displacement monitoring a

C-Tech Systems, B.V. [formerly Nordson DIMA]

Hot Bar Soldering Machines

New Equipment | Other

We offer a number of soldering machines for bonding Flex to PCB, Connector to PCB and micro cables to PCB/ connectors.

Production Technologies Ltd

Advanced Thermal Management

Advanced Thermal Management

New Equipment | Assembly Services

S-Bond® solders are unique in their ability to provide a high performance thermal joint between these materials. S-Bond materials offer approximately 10 times the thermal conductivity of most thermal epoxies along with the ability to bond in air with

S-Bond Technologies

MK Electron Co. Ltd (MKE)

Industry Directory | Manufacturer

We are manufacturer of key products for semiconductor back end process and interconnect materials. Our main products:solder balls, Bonding wire (Au, Ag, Cu, Pd-Cu),sputtering target & EVM materials.

Toddco3

Industry Directory | Manufacturer

Toddco3 manufactures automated assembly equipment for the electronics industry that ACF bonds, solders or welds flexible circuits, glass, PCBs or metals.


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