Full Site - : solder bridging at qfn (Page 11 of 25)

Finetech to Highlight Precision Rework and BGA Reball systems at SMTAI 2010

Industry News | 2010-10-01 01:05:06.0

Finetech will highlight two rework systems ― the FINEPLACER® core and the Martin Expert 10.6XL ― and the Martin Reball 3.1 unit in booth 406 at the upcoming SMTA International, scheduled to take place October 26-27, 2010 at the Walt Disney World Swan and Dolphin Resort in Orlando, FL.

Finetech

SHENMAO Exhibits at IMAPS System in Package June 27-28, 2017 Introducing 3 New Semiconductor Packaging Fluxes

Industry News | 2017-06-25 20:33:39.0

SHENMAO Technology, Inc. introduces New Generation Ultra Tacky Flux SMF-WC52 applied in the Flip Chip dipping process. Its high tacky property keeps Chip in place during reflow for excellent soldering performance, while creating outstanding solder joint strength.

Shenmao Technology Inc.

Indium Corporation Technology Expert to Present at Assembly, Cleaning, and Reliability Workshop

Industry News | 2014-05-22 11:36:25.0

Indium Corporation's Derrick Herron, technical support engineer, will serve as an expert presenter at ZESTRON’s Assembly, Cleaning, and Reliability Hands-on Workshop on June 10 in Franklin, Mass.

Indium Corporation

MARTIN to Demonstrate Stand Alone QFN Solder Bumping and BGA Reball Unit at the CTEA Austin Expo & Tech Forum

Industry News | 2010-10-04 15:37:18.0

MARTIN will demonstrate the Prebump/Reball 03.1 unit at the upcoming Central Texas Electronics Association (SMTA/IMAPS) Expo & Tech Forum, scheduled to take place, October 7, 2010 at the Norris Conference Centers in Austin, TX.

Finetech

MARTIN to Demonstrate Stand Alone QFN Solder Bumping and BGA Reball Unit at the SMTA Arizona-Sonora Expo & Tech Forum

Industry News | 2010-11-18 11:04:08.0

MARTIN will demonstrate the Prebump/Reball 03.1 unit at the upcoming SMTA Arizona-Sonora Expo & Tech Forum, scheduled to take place Wednesday, December 1, 2010 at the Fiesta Inn Resort & Conference Center in Tempe, AZ.

Finetech

AIM Solder’s Karl Seelig to Present during S12 Technical Session at IPC APEX 2013

Industry News | 2013-01-18 16:47:20.0

AIM Solder announces that its VP of Technology Karl Seelig will present his paper titled “Conformal Coating Over No-Clean Flux” at the upcoming IPC APEX Expo

AIM Solder

See Seika Machinery, Inc.'s New Advanced Machinery at SMTA International 2011

Industry News | 2011-09-21 14:09:34.0

Seika Machinery, Inc., a leading provider of advanced machinery, materials and engineering services, will highlight its new advanced machinery in Booth #136 at the upcoming SMTA International Conference & Exhibition

Seika Machinery, Inc.

SEHO to Debut AOI Feature for the Selective Soldering Process at the 2012 IPC APEX Expo

Industry News | 2012-01-20 15:02:15.0

SEHO Systems GmbH will highlight the new AOI function for its best-selling selective soldering system – the PowerSelective - in Booth #3521 at the upcoming IPC APEX Expo.

SEHO Systems GmbH

SEHO Systems’ Christian Ott to Discuss Costs of Soldering in Nitrogen Atmospheres at SMTAI

Industry News | 2013-09-16 14:25:35.0

SEHO North America, Inc. announces that Christian Ott, Senior Sales and Project Manager, will present a paper titled, “Soldering in Nitrogen Atmosphere – Do Quality Aspects Justify the Costs?” at the upcoming SMTA International Exhibition, scheduled to take place October 15-16, 2013 at the Fort Worth Convention Center in Texas.

SEHO Systems GmbH

EVS International to Display EVS 1000 Solder Recovery System at Productronica 2007

Industry News | 2007-11-01 02:15:38.0

October 31, 2007 - EVS International, the leader in solder recovery, announces that it will showcase the EVS 1000 solder recovery system in stand A3.544 at the upcoming Productronica 2007 exhibition and conference, scheduled to take place November 13-16, 2007 at the Munich Trade Fair Center in Munich, Germany.

EVS International


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