Industry News | 2010-05-29 18:57:32.0
MARTIN will demonstrate the Reball/Prebump 03.1 unit at the upcoming SMTA Upper Midwest Expo, scheduled to take place Wednesday, June 9, 2010, at the Sheraton Bloomington Hotel in Bloomington, MN. This standalone unit is an easy and cost effective solution for BGA reballing and QFN solder bumping.
Industry News | 2022-12-21 11:02:58.0
Indium Corporation will share a variety of presentations on insightful topics ranging from artificial intelligence, the capabilities of gallium, advanced materials, and more, at the SMTA Pan Pacific Microelectronics Symposium (SMTA PanPac), Jan. 30-Feb. 2, Kauai, Hawaii, U.S.
Industry News | 2015-03-10 11:09:24.0
Essemtec AG, the Swiss manufacturer of production systems for electronic assembly and packaging, will exhibit at booth #7.135 at SMT/HYBRID/PACKAGING, scheduled to take place May 5-7, 2015 in Nuremberg. Company representatives will demonstrate the latest generation of Paraquda pick-and-place system and Scorpion dispensing system. Other highlights will be the new SMT storage device Cubus Large and the new highly flexible and cost-effective pick-and-place system Lynx.
Industry News | 2015-04-06 12:41:41.0
Essemtec AG, the Swiss manufacturer of production systems for electronic assembly and packaging, will exhibit at booth #7.135 at SMT/HYBRID/PACKAGING, scheduled to take place May 5-7, 2015 in Nuremberg. Company representatives will demonstrate the latest generation of Paraquda pick-and-place system and Scorpion dispensing system. Other highlights will be the new SMT storage device Cubus Large and the new highly flexible and cost-effective pick-and-place system Lynx.
Industry News | 2024-03-11 18:20:47.0
MIRTEC will showcase its complete line of 3D AOI and SPI Inspection Systems at Booth #2100 during the 2024 IPC APEX EXPO scheduled to take place April 9-11, 2024, at the Anaheim Convention Center. "MIRTEC will feature a total of seven systems specifically designed to address the full spectrum of inspection requirements associated with the Electronics Manufacturing Industry including two new state-of-the-art 3D AOI Solutions," stated Brian D'Amico, President of MIRTEC's North American Sales and Service Division.
Industry News | 2009-09-17 14:28:17.0
NASHVILLE — September 2009 — Kyzen, a world leading provider of environmentally responsible precision cleaning products for electronics and high-technology manufacturing operations, announces that Mike Bixenman, CTO, along with co-author Mike Konrad, President of Aqueous Technologies, will hold a presentation titled “Cleaning for Reliability Post QFN Rework” at the upcoming SMTA International conference, scheduled to take place October 6-7, 2009 at The Town and Country Resort and Convention Center in San Diego.
Industry News | 2011-09-28 19:53:50.0
AIM announces that Karl Seelig, Vice President of Technology, will present a paper titled “Overcoming the Challenges of QFNs” at the upcoming SMTA International Conference & Exhibition.
Industry News | 2010-09-15 21:55:19.0
MARTIN will demonstrate the Prebump/Reball 03.1 unit at the upcoming SMTA Capital Expo and Tech Forum, scheduled to take place Tuesday, September 21, 2010 at the Johns Hopkins University/Applied Physics Lab in Laurel, MD.
Industry News | 2011-10-07 23:08:54.0
MARTIN will showcase its Mini-Oven Reball/Solder Bumping unit at the upcoming SMTA LA/Orange County Expo & Tech Forum.
Industry News | 2011-05-10 19:11:40.0
MARTIN will showcase its Mini-Oven 04 Reball/Prebump unit at the upcoming Space Coast Expo and Tech Forum, scheduled to take place June 9, 2011 at the Melbourne Auditorium in Melbourne, FL.
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