Industry News | 2018-09-19 21:20:03.0
Nordson DAGE and Nordson YESTECH, divisions of Nordson Corporation (NASDAQ: NDSN), will exhibit in Booth #207 at SMTA International, scheduled to take place Oct. 16-17, 2018 at the Donald Stephens Convention Center in Rosemont, IL. The Nordson Test & Inspection team will showcase a suite of award-winning systems including the Quadra™ 7 X-ray Inspection System, Nordson YESTECH FX-940 Ultra AOI and FX-940-UV AOI.
Industry News | 2017-11-07 17:14:32.0
Nordson Corporation (NASDAQ: NDSN) announces that eight divisions from its Advanced Technology segment will be exhibiting together at Productronica, the world's leading trade fair for electronics development and production, to be held in Munich, Germany during November 14-17, 2017, in Hall A2, stands 245, 345, and 445.
Industry News | 2015-04-21 16:12:41.0
Nordson YESTECH, a subsidiary of Nordson Corporation (Nasdaq: NDSN) is pleased to announce that it was awarded a 2015 SMT China Vision Award in the category of Inspection & Testing-AOI for its FX-940 Automated Optical Inspection (AOI) In-line PCB inspection system. The award was presented to the company during an April 21, 2015 ceremony at the Shanghai World Expo Exhibition & Convention Center during NEPCON China.
Industry News | 2023-06-12 20:40:57.0
Atlanta, GA – Koh Young, the industry leader in True3D™ measurement-based inspection solutions, is pleased to announce its return to SEMICON West with a new series of inspection solutions designed to increase advanced package and semiconductor yield. Several of our latest inspection machines will be on display during SEMCION West in booth 329 from 11-13 July 2023 in the Moscone Center, San Francisco, CA.
Industry News | 2016-08-31 19:01:58.0
Nordson YESTECH will exhibit in Booth #606 at SMTA International, scheduled to take place September 27-28, 2016 at the Donald Stephens Convention Center in Rosemont, IL. The YESTECH team will demonstrate the FX-940 ULTRA 3D AOI with cutting-edge 3D technology for the inspection of solder defects, lead defects/lifted leads, component presence and co-planarity of chips, BGAs and other height sensitive devices.
New Equipment | Rework & Repair Equipment
Visit PSI's main Coplanarity Services page for more information. PSI has over 20 years experience restoring gull wing leads on QFP and SOIC packages, as well as myriad surface mount connector styles. The goal of lead restoration is not to mimic "l
Industry News | 2007-11-01 20:29:37.0
November 1, 2007 - Lloyd Doyle announces they will showcase the IBIS system, a brand new development for solder bump inspection, in Hall A1 Stand 347 at the upcoming Productronica 2007 exhibition and conference scheduled to take place November 13-16, 2007 at the Munich Trade Fair Center in Munich, Germany.
Industry News | 2020-09-06 04:37:56.0
CyberOptics® Corporation (NASDAQ: CYBE) will present at the SEMICON Taiwan Global SiP Summit on September 24, 2020 at 4:20pm. Tim Skunes, VP of R&D at CyberOptics, will share the technical presentation 'Fast, 100% 3D Wafer Bump Metrology and Inspection to Improve Yields and 3D System Integration'.
Industry News | 2020-11-18 15:38:26.0
CyberOptics® Corporation (NASDAQ: CYBE) will present at the Virtual IEEE International Conference on Physical Assurance and Inspection of Electronics (PAINE) on December 16th at 8:00amCT.
Industry News | 2015-12-04 13:06:33.0
December 3, 2015 – Continuing to invest in the most advanced stencil production technologies, FCT Assembly’s Fine Line Stencil division today announced that it has added a next-generation micro-milling system to its operation to enable production of highly-accurate step -- or multi-level -- stencils.
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