Industry News | 2011-09-14 12:04:43.0
The SMTA announced a session on QFN Assembly and Reliability will take place on Tuesday, October 18 during their annual conference, SMTA International, in Ft. Worth, Texas. Andrew Mawer of Freescale Semiconductor will chair the session and Viswam Puligandla, Ph.D., Nokia (Retired) will co-chair.
Industry News | 2013-09-10 12:18:26.0
The Surface Mount Technology Association (SMTA)'s Intermountain Chapter will hold its annual technical symposium on September 19 at the University of Utah in the Warnock Engineering Building, Salt Lake City, Utah.
Industry News | 2018-08-16 20:05:44.0
Indium Corporation Research Chemist, Mary Ma, and Area Technical Manager for Eastern China, Wisdom Qu, will present their papers at the 2018 SMTA China South Technology Conference on Aug. 28 in Shenzhen, China. Their papers were voted by their peers as two of the top five “Best Papers” presented in recent years at SMTA South China and SMTA East China, earning them the opportunity to present them again at this year's show.
Industry News | 2013-01-19 07:46:16.0
Information that inspires innovation is center-stage for design, printed boards, electronics assembly, test and printed electronics
Industry News | 2018-10-15 18:59:13.0
EVS International, the leader in solder recovery, will exhibit with InterLatin on Stand 77 at the SMTA Guadalajara Expo & Tech Forum, scheduled to take place Nov. 14 - 15, 2018 at the Expo Guadalajara. EVS will show the EVS 500LF Solder Recovery System that can quickly recover up to 80 percent of pure solder with a higher ROI from the waste dross.
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Ultimate Performance, BGA Rework Station for small-large PCBs up to 24"/620mm The PDR E6 XL BGA Rework Station is made of only the finest materials and components for optimum precision and rework excellence. PDR's E6 SMD Rework Station is PDR's larg
Technical Library | 2017-09-28 16:36:33.0
These nano-coatings also refine the solder paste brick shape giving improved print definition. These two benefits combine to help the solder paste printing process produce an adequate amount of solder paste in the correct position on the circuit board pads. Today, stencil aperture area ratios from 0.66 down to 0.40 are commonly used and make paste printing a challenge. This paper presents data on small area ratio printing for component designs including 01005 Imperial (0402 metric) and smaller 03015 metric and 0201 metric chip components and 0.3 mm and 0.4 mm pitch micro BGAs.
Technical Library | 2011-09-22 16:30:11.0
The remainder of this paper will deal with the adhesive cure mechanism most often found in the microelectronics industry; the thermal activation and cure of adhesives that are most commonly based on epoxy backbones. The use of heat is already prevalent in the microelectronics industry as most printed circuit board assemblies use some element of this thermal energy (reflow ovens for example) during the component soldering and assembly stage or during their burn-in stage (convection ovens).
Industry News | 2012-05-15 10:17:11.0
Rochester Institute of Technology has partnered with equipment supplier MARTIN to utilize a MARTIN Expert 10.6 Rework Station and Mini-Oven unit in its Center for Electronics Manufacturing and Assembly (CEMA)
