Industry News | 2015-04-09 11:39:02.0
Nordson YESTECH, a subsidiary of Nordson Corporation (Nasdaq: NDSN) will showcase its FX-940 Automated Optical Inspection (AOI) In-line PCB inspection system for the first time in Europe in Booth #7A-131 at SMT/Hybrid/Packaging, scheduled to take place May 5-7, 2015 at the Messe in Nuremberg, Germany.
Industry News | 2021-10-28 11:40:07.0
Collaboration with ASM Assembly Systems advances adoption of Smart Factory technologies to boost quality, productivity & process optimization
Industry News | 2013-02-11 17:37:12.0
Achieve the highest quality standards, production yield and process efficiency for programming mission critical devices at a reduced cost
Industry News | 2013-09-03 14:27:38.0
The ÉOLANE Group is the 4th largest European electronic subcontractor, currently employing 3,000 personnel across 20 European facilities, with 10 sites manufacturing in France.
Industry News | 2017-08-15 21:18:36.0
CyberOptics® Corporation will demonstrate the SQ3000™ 3D Automated Optical Inspection (AOI) system with the new Ultra-High Resolution Multiple-Reflection Suppression (MRS) Sensor and QX250i™ AOI in Booth #1416 at SMTA International, scheduled to take place Sept. 19-20, 2017 at the Donald Stephens Convention Center in Rosemont, IL. The SQ3000™ 3D AOI system, deemed best-in-class, maximizes ROI and line utilization with multi-view 3D sensors that capture and transmit data simultaneously and in parallel, accelerating 3D inspection speed versus alternate technology. The proprietary MRS sensor technology with the highly sophisticated 3D fusing algorithms offers microscopic image quality at production speeds.
Industry News | 2018-03-27 20:24:22.0
CyberOptics® Corporation today announced plans to exhibit in Hall D, Stand K112 at NEPCON Korea, scheduled to take place April 11-13, 2018 at the COEX Exhibition Center in Seoul, Korea. Company representatives will demonstrate the new high-speed SQ3000™3D CMM, an extension of the MRS-enabled SQ3000 platform deemed best-in-class, along with the QX250i™ double-sided AOI system.
Technical Library | 2013-07-25 14:02:15.0
Bottom-termination components (BTC), such as QFNs, are becoming more common in PCB assemblies. These components are characterized by hidden solder joints. How are defects on hidden DFN joints detected? Certainly, insufficient solder joints on BTCs cannot be detected by manual visual inspection. Nor can this type of defect be detected by automated optical inspection; the joint is hidden by the component body. Defects such as insufficients are often referred to as "marginal" defects because there is likely enough solder present to make contact between the termination on the bottom-side of the component and the board pad for the component to pass in-circuit and functional test. Should the board be subjected to shock or vibration, however, there is a good chance this solder connection will fracture, leading to an open connection.
Technical Library | 2020-11-24 23:12:27.0
In a lead-free reflow process, temperatures are higher, and materials use outgasses more than in a leaded reflow process. The trends toward higher density populated boards and more pin-in-paste technology also increase solder paste use. More components and more solder paste result in more outgassing of chemistry during the reflow process. Some assemblies report condensation of vapors when the cold printed circuit board enters the oven. Little is known about the interaction between these condensed materials in terms of the interaction between these condensed materials and the reliability of the assembly. Apart from the question of reliability, a printed circuit board contaminated with a small film of residues after reflow soldering is not desirable.
Technical Library | 2020-07-29 19:58:48.0
The majority of flexible circuits are made by patterning copper metal that is laminated to a flexible substrate, which is usually polyimide film of varying thickness. An increasingly popular method to meet the need for lower cost circuitry is the use of aluminum on Polyester (Al-PET) substrates. This material is gaining popularity and has found wide use in RFID tags, low cost LED lighting and other single-layer circuits. However, both aluminum and PET have their own constraints and require special processing to make finished circuits. Aluminum is not easy to solder components to at low temperatures and PET cannot withstand high temperatures. Soldering to these materials requires either an additional surface treatment or the use of conductive epoxy to attach components. Surface treatment of aluminum includes the likes of Electroless Nickel Immersion Gold plating (ENIG), which is extensive wet-chemistry and cost-prohibitive for mass adoption. Conductive adhesives, including Anisotropic Conductive Paste (ACP), are another alternate to soldering components. These result in component substrate interfaces that are inferior to conventional solders in terms of performance and reliability. An advanced surface treatment technology will be presented that addresses all these constraints. Once applied on Aluminum surfaces using conventional printing techniques such as screen, stencil, etc., it is cured thermally in a convection oven at low temperatures. This surface treatment is non-conductive. To attach a component, a solder bump on the component or solder printed on the treated pad is needed before placing the component. The Aluminum circuit will pass through a reflow oven, as is commonly done in PCB manufacturing. This allows for the formation of a true metal to metal bond between the solder and the aluminum on the pads. This process paves the way for large scale, low cost manufacturing of Al-PET circuits. We will also discuss details of the process used to make functional aluminum circuits, study the resultant solder-aluminum bond, shear results and SEM/ EDS analysis.
Industry News | 2012-09-12 19:55:00.0
Kyzen, will introduce two new innovative cleaning products
