New Equipment | Cleaning Equipment
A Complete Stencil Cleaning Process - From One Source! Clean solder paste, adhesives and flux residue in one machine Two ultrasonic wash tanks eliminate cross contamination issues Safely clean solder paste at ambient temperature and othe
Industry Directory | Consultant / Service Provider / Manufacturer
ULT is a vendor of efficient fume extraction solutions for air purification. The company's systems are utilized for the removal of laser fumes, soldering fumes, odors, vapors, gases, dusts etc. in electronics production.
AF04 Cleans condensation traps, solder frames and carriers The kolb AF04 is a three chamber system which enables short cycle times. The system is therefore capable within a short time of parallel process cleaning, rinsing and drying. It cl
Technical Library | 2023-02-13 18:56:42.0
This paper describes the results of an intensive whisker formation study on Pb-free assemblies with different levels of cleanliness. Thirteen types of as-received surface-mount and pin-through-hole components were cleaned and intentionally contaminated with solutions containing chloride, sulfate, bromide, and nitrate. Then the parts were assembled on double-sided boards that were also cleaned or intentionally contaminated with three fluxes having different halide contents. The assemblies were subjected to high-temperature/high-humidity testing (85_C/85% RH). Periodic examination found that contamination triggered whisker formation on both exposed tin and solder fillets. Whisker occurrence and parameters depending on the type and level of contamination are discussed. Cross-sections were used to assess the metallurgical aspects of whisker formation and the microstructural changes occurring during corrosion.
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All Through-hole & SMT PC Board Assembly equipments,Reflow and wavesoldering equipments,Humiseal conformal coating,SCH Technologies conformal coating equipments,Kyzen Cleaning solutions,Metronelec Solderability tester,Curing oven
Industry News | 2016-08-03 20:06:03.0
Indium Corporation's new reclaim and recycle program is now offering customers credit for their solder pot dross and contaminated solder.
Technical Library | 2016-02-11 18:26:43.0
Although reflow ovens may not have been dramatically changed during the last decade the reflow process changes step by step. With the introduction of lead-free soldering not only operation temperatures increased, but also the chemistry of the solder paste was modified to meet the higher thermal requirements. Miniaturization is a second factor that impacts the reflow process. The density on the assembly is increasing where solder paste deposit volumes decreases due to smaller pad and component dimensions. Pick and place machines can handle more components and to meet this high through put some SMD lines are equipped with dual lane conveyors, doubling solder paste consumption. With the introduction of pin in paste to solder through hole components contamination of the oven increased due to dripping of the paste.
Events Calendar | Wed May 17 00:00:00 EDT 2023 - Wed May 17 00:00:00 EDT 2023 | Milwaukee, Wisconsin USA
"Risks of Over-Specifying Test Requirements: Testing Shielded Cables at High Voltage" | Conference Seminar | A Professional Development Course by CAMI Research
ALPHA® Telecore XL-825 lead-free cored solder wire minimizes spattering in hand soldering operations, thus reducing circuit board contamination and enhancing worker safety and comfort.
With the July2006 ROHS deadline approaching SigmaPrint Technologies are now able to supply colour coded �green� Squeegee assemblies. Colour coded squeegees are of great help to customers who are exempt from the directive, helping to ensure that the
