Electronics Forum | Tue Nov 29 14:55:17 EST 2011 | jlawson
N2 is a reflow process widener so to speak, for leaded reflow less of a impact, for LF more impact, and if using finer LF solder pastes T4,T5 and smaller paste deposits generally, it helps widen window for flux in paste in oxide protection during soa
Electronics Forum | Sun Nov 26 08:21:41 EST 2006 | callckq
Dear All, Is anyone know why too much solder paste might cause tombstoning defect? Thanks
Electronics Forum | Tue Mar 11 09:49:59 EST 2003 | MGARCIA
DO YOU KNOW? WHAT KIND OF SOLDER PASTE IS BETTER IN ORDER TO AVOID THE TOMBSTONE DEFECT IN SMT PROCESS.
Electronics Forum | Mon Feb 18 03:40:04 EST 2008 | akareti
Hi everybody, I found a defect varistor 0603 Tombstone and poor welting when we use component that terminal is Silver palladium (Ag/ Pd) with Leaded solder paste (63/37). Then we change alternative component that terminal is Ni/ Sn the result not fou
Electronics Forum | Tue Sep 18 10:22:22 EDT 2001 | jschake
Paste Flux / Reflow: Our experiments indicated that the combination of no-clean solder paste and air forced convection reflow produced the fewest tombstone defects, followed by water-soluble paste reflowed in air, and most tombstones occurring with
Electronics Forum | Fri Aug 25 09:51:29 EDT 2000 | A. Marques
Hi, Somebody can tell me an good site of images of the reflow process. I need this to put in a document for formation. This images are: Chip defects (like tombstone, missing, solder bridge, etc..) Cic defects Best regards
Electronics Forum | Sat Mar 15 00:52:18 EST 2003 | Grant
Hi, We had tomb-stoning on a product, and it was quite severe. We eliminated it by reducing the amount of solder paste on the small passible component pads. We used a 5 thou stencil, with 20% reduction, and it eliminated the problem. Regards, Gra
Electronics Forum | Thu Dec 16 20:16:48 EST 1999 | Henry C. Yao
What are the parameters to be adjusted to prevent this defect. What are the things that I have to look at. I believe that when the components get smaller, occurrence of this defect increases. Also, there is the problem of solder paste condition.
Electronics Forum | Tue Mar 11 10:13:15 EST 2003 | genny
Some people have said that for smaller components like 0402, a 2% silver paste (62/36/2)has helped reduce the tombstones. The reasoning is that this paste has a longer plastic zone compared to a true eutectic solder, and if there is any uneven heati
Electronics Forum | Thu Oct 31 16:13:46 EST 2002 | babe
If your processing with Nitrogen, tombstoning can be caused by your cooling rate. Go thru the solid/liquid phase of the solder slower..iN other words as you transition into or out of the liquidus pahse if 63/37 alloy 183C, ensure that your Delta are
winsouce.jpg)
