Electronics Forum | Fri Aug 01 02:10:26 EDT 2008 | fowlerchang
Pad design is not only the size of pad but also the distance between two pad. N2 will increase tombstone as we tested. 10 zones reflow oven and slow temperature ramp will reduce this defect. MustII is the equipment which is used to test the solderabi
Electronics Forum | Sun May 04 22:10:20 EDT 2003 | Thomas
Did u ever try a anti-tombstone solder paste to try to eliminate this problem ??
Electronics Forum | Wed May 07 09:24:33 EDT 2003 | davef
Kris The majority of our tombstoning in very small passive SMT is caused by imperfections in end-cap solderability protection plating.
Electronics Forum | Fri May 30 11:23:10 EDT 2003 | dsuraski
AIM has an article that includes anti-tombstoning solder paste information. It's called "Reducing The Tombstoning of Small Discrete Components" and is located at http://www.aimsolder.com/technical_articles.cfm#14 Or I can send a copy to anyone inte
Electronics Forum | Mon May 05 11:35:00 EDT 2003 | Grant
Hi, This is an interesting point. I use Koki paste from Japan, and it's wonderful, however what properties of solder paste would make it "anti tombstone" paste? How does led free effect tomb-stoning? That would be interesting to know. We might go
Electronics Forum | Mon May 26 04:02:13 EDT 2003 | Franky
Dear sir, I think so with every idea , everyone is correct , paste , pattern of pad design ,profiling or solder mask on PCB ,and one of the cause of tombstone that I found is alignment of machine placing and solder printing , from my experience many
Electronics Forum | Thu Aug 28 20:24:30 EDT 2003 | yukim
Hi, do you know how much the problem can be reduced by using anti-tombstoning solder paste? I tried two different lots using same solder paste (containing Ag). With one we did not see any improvement and with the other one, a lot. So, I am not quite
Electronics Forum | Sat May 03 00:58:51 EDT 2003 | ken
Did you check if the height of solder mask between two pads is higher than pads?
Electronics Forum | Fri May 30 11:24:45 EDT 2003 | dsuraski
We also use microns to describe solder paste powder particle sizes.
Electronics Forum | Fri May 16 15:45:00 EDT 2003 | swagner
If the only difference between the two products is the board supplier I believe thats where I would start, we had a similar problem like this two months ago and it turned out to be a faulty (thin) HASL layer which did not meet our print tolerance. T
